10
FN6073.4
July 26, 2007
FIGURE 10. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL8488E/ISL8489E)
FIGURE 11. DRIVER SKEW vs TEMPERATURE
(ISL8488E/ISL8489E)
FIGURE 12. DRIVER PROPAGATION DELAY vs
TEMPERATURE (ISL8490E/ISL8491E)
FIGURE 13. DRIVER SKEW vs TEMPERATURE
(ISL8490E/ISL8491E)
FIGURE 14. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL8488E/ISL8489E)
FIGURE 15. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL8488E/ISL8489E)
Typical Performance Curves V
CC
= 5V, T
A
= +25°C; Unless Otherwise Specified.
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
PROPAGATION DELAY (ns)
t
PLHY
t
PHLY
t
PLHZ
t
PHLZ
450
500
550
600
650
700
750
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
|t
PLHY
- t
PHLZ
|
|t
PHLY
- t
PLHZ
|
|CROSS PT. OF Y AND Z TO CROSS PT. OF Y AND Z|
0
50
100
150
200
250
-40 0 50 85
TEMPERATURE (°C)
-25 25 75
t
PLHY
t
PHLZ
PROPAGATION DELAY (ns)
t
PLHZ
16
18
20
22
24
26
28
30
t
PHLY
-40 0 50 85
TEMPERATURE (°C)
SKEW (ns)
-25 25 75
|t
PLHY
- t
PHLZ|
|t
PHLY
- t
PLHZ|
|CROSS PT. OF Y AND Z TO CROSS PT. OF Y AND Z
|
0
1
2
3
4
5
TIME (400ns/DIV)
0
RECEIVER OUTPUT (V)
3
4
1
2
R
DIFF
= 54Ω, C
L
= 100pF
0
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
Y
Z
5
TIME (400ns/DIV)
0
RECEIVER OUTPUT (V)
3
4
1
2
R
DIFF
= 54Ω, C
L
= 100pF
0
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
Y
Z
5
ISL8488E, ISL8489E, ISL8490E, ISL8491E
11
FN6073.4
July 26, 2007
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
518
PROCESS:
Si Gate BiCMOS
FIGURE 16. DRIVER AND RECEIVER WAVEFORMS,
LOW TO HIGH (ISL8490E/ISL8491E)
FIGURE 17. DRIVER AND RECEIVER WAVEFORMS,
HIGH TO LOW (ISL8490E/ISL8491E)
Typical Performance Curves V
CC
= 5V, T
A
= +25°C; Unless Otherwise Specified.
TIME (20ns/DIV)
0
RECEIVER OUTPUT (V)
3
4
1
2
R
DIFF
= 54Ω, C
L
= 100pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
Y
Z
TIME (20ns/DIV)
0
RECEIVER OUTPUT (V)
3
4
1
2
R
DIFF
= 54Ω, C
L
= 100pF
0
5
DRIVER OUTPUT (V)
0
5
DRIVER INPUT (V)
DI
RO
Y
Z
ISL8488E, ISL8489E, ISL8490E, ISL8491E
12
FN6073.4
July 26, 2007
ISL8488E, ISL8489E, ISL8490E, ISL8491E
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) C AM BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010) BM M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.1890 0.1968 4.80 5.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N8 87
α
-
Rev. 1 6/05

ISL8489EIBZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
RS-422/RS-485 Interface IC 14LD -40+85 5V TRANSC 1TX/1RX FL
Lifecycle:
New from this manufacturer.
Delivery:
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