Negative-Going V
CC
Transients
These devices are relatively immune to short-duration,
negative-going V
CC
transients (glitches).
The Typical Operating Characteristics show the
Maximum Transient Duration vs. Threshold Overdrive
graph, for which output pulses are not generated. The
graph shows the maximum pulse width that a negative-
going V
CC
transient may typically have before the
devices issue output signals. As the amplitude of the
transient increases, the maximum allowable pulse width
decreases.
UCSP Reliability
The chip-scale package (UCSP) represents a unique
packaging form factor that may not perform equally to a
packaged product through traditional mechanical reliabil-
ity tests. CSP reliability is integrally linked to the user’s
assembly methods, circuit board material, and usage
environment. The user should closely review these areas
when considering use of a CSP package. Performance
through Operating Life Test and Moisture Resistance
remains uncompromised as it is primarily determined by
the wafer-fabrication process.
Mechanical stress performance is a greater considera-
tion for a CSP package. CSPs are attached through
direct solder contact to the user’s PC board, foregoing
the inherent stress relief of a packaged product lead
frame. Solder joint contact integrity must be considered.
Information on Maxim’s qualification plan, test data, and
usage recommendations are detailed in the UCSP appli-
cation note, which can be found on Maxim’s website at
www.maxim-ic.com.
Chip Information
TRANSISTOR COUNT: 512
PROCESS: BiCMOS
MAX6406–MAX6411
Voltage Detectors in 4-Bump (2
X
2)
Chip-Scale Package
_______________________________________________________________________________________ 7
Figure 1. Interfacing to Different Logic Voltage Components
