NLAS2066
www.onsemi.com
9
PACKAGE DIMENSIONS
US8
US SUFFIX
CASE 493−02
ISSUE D
0.30
8X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50
RECOMMENDED
1
PITCH
3.40
0.68
8X
DIM
A
MIN MAX MIN MAX
INCHES
1.90 2.10 0.075 0.083
MILLIMETERS
B 2.20 2.40 0.087 0.094
C 0.60 0.90 0.024 0.035
D 0.17 0.25 0.007 0.010
F 0.20 0.35 0.008 0.014
G 0.50 BSC 0.020 BSC
H 0.40 REF 0.016 REF
J 0.10 0.18 0.004 0.007
K 0.00 0.10 0.000 0.004
L 3.00 3.20 0.118 0.128
M 0 6 0 6
N 0 10 0 10
P 0.23 0.34 0.010 0.013
R 0.23 0.33 0.009 0.013
S 0.37 0.47 0.015 0.019
U 0.60 0.80 0.024 0.031
V 0.12 BSC
0.005 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSION OR GATE BURR. MOLD
FLASH. PROTRUSION AND GATE BURR SHALL
NOT EXCEED 0.14MM (0.0055”) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
AND PROTRUSION SHALL NOT EXCEED 0.14MM
(0.0055”) PER SIDE.
5. LEAD FINISH IS SOLDER PLATING WITH
THICKNESS OF 0.0076−0.0203MM (0.003−0.008”).
6. ALL TOLERANCE UNLESS OTHERWISE
SPECIFIED ±0.0508MM (0.0002”).
LB
A
P
G
41
58
C
K
D
SEATING
J
S
R
U
DETAIL E
V
F
H
N
R 0.10 TYP
M
DETAIL E
T
M
0.10 (0.004) XY
T0.10 (0.004)
____
____
PLANE
X Y
T
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