MCP2221 BREAKOUT MODULE
USER’S GUIDE
2014 Microchip Technology Inc. DS50002282A-page 31
Appendix B. Bill of Materials
TABLE B-1: BILL OF MATERIALS
Qty Reference Description Manufacturer Part Number
2 C1, C3 Cap. cer. 4.7 µF 10V 10% X5R SMD 0805 Taiyo Yuden Co.,
Ltd.
LMK212BJ475KD-T
2 C2, C5 Cap. cer. 0.1 µF 16V 10% X7R SMD 0603 NIC Components
Corp.
NMC0603X7R104K16TRPF
1 C4 Cap. cer. 0.47 µF 6.3V 10% X5R SMD 0603 Murata Electronics
®
GRM188R60J474KA01D
1 J3 Conn. hdr - 2.54 female 1x6 Gold TH R/A Sullins Connector
Solutions
PPPC061LGBN-RC
1 J4 Conn. hdr - 2.54 male 1x3 Gold 5.84MH TH
vert.
FCI 68000-103HLF
1 J5 Conn. USB Mini-B female SMD R/A Hirose Electric Co.,
Ltd.
UX60SC-MB-5ST(80)
2 J6, J7 Conn. hdr - 2.54 male 1x2 gold 5.84MH TH
vert.
FCI 68001-202HLF
3 JP1 – JP3 Mech. HW Jumper 2.54 mm 1x2 handle gold TE Connectivity, Ltd. 881545-2
PCB Printed Circuit Board – MCP2221 Breakout
Module
— 104-00559
1R1Resistor TKF 10k 5% 1/10W SMD 0603 Panasonic
®
- ECG ERJ-3GEYJ103V
2 R2, R3 Resistor TKF 2.2 k 5% 1/10W SMD 0603 NIC Components
Corp.
NRO6J222TRF
1 U1 USB-to-I
2
C and UART Bridge TSSOP-14
Microchip
Technology Inc,
MCP2221-I/ST
1 U2 Analog LDO 3.3V MCP1825ST-3302E/DB
SOT-223-3
MicrochipTechnology
Inc.
MCP1825S-3302E/DB
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.