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7
In that case the FUSB303 provides functionality to resolve
to a stable attached state. This functionality can be turned
on and off via the REMEDY_EN and DCABLE_EN bits.
Multiple cases are tried and some of the register settings will
be changed to try to achieve stable attach. The I_REMEDY
interrupt will allow the processor to know that this
functionality has been triggered.
AUTOSNK Mode
When the FUSB303 is powered directly from VBAT the
AUTO_SNK_EN mode can be used to prevent the
application from attaching as a Source when the battery is
weak or disconnect and attach as a Sink. With
AUTO_SNK_EN enabled the port will attempt to configure
as a Sink when attached to another DRP. If connected to
another Sink, the port will detach. The threshold at which
AUTOSNK can be triggered can be programmed via the
AUTH_SNK_TH bits. The I_AUTOSNK interrupt is
triggered whenever this functionality is invoked.
Power Up, Initialization and Reset, Interrupt Operation,
I
2
C Interface
The FUSB303 includes a full I
2
C slave controller. The I
2
C
slave fully complies with the I
2
C specification version 6
requirements. This block is designed for fast mode.
Examples of an I
2
C write and read sequence are shown
Figure 5 and Figure 6 respectively.
NOTE: Single byte write is initiated by Master with P immediately following the first data byte and slave A
Figure 5. I
2
C Write Example
S Slave Address WR Register Address KA A Write Data A Write Data K+1 A Write Data K+2 A Write Data K+N−1 A P
8bits 8bits 8bits
NOTE: If Register is not specified Master will begin read from current register. In this case only sequence showing in Red bracket
is needed
Figure 6. I
2
C Write Example
Single or multi byte read executed from current register location (Single Byte
read is initiated by Master with NA immediately following first data byte
S Slave Address WR A Register Address K A S Slave Address RD A Read Data K A Read Data K+1 A Read Data K+N−1NA
P
8bits 8bits 8bits 8bits
Register address to Read specified
S Start Condition
A Acknowledge (SDA Low)
NA NOT Acknowledge (SDA high)
WR Write=O
RD Read =1
P Stop Condition
From Master to Slave
From Slave to Master
When power is first applied, the FUSB303 will power up
in the configuration set by the PORT/DEBUG_N input with
Audio Accessory Support enabled and all interrupts
masked. If the ADDR/ORIENT input is HIGH or LOW (I
2
C
mode) the local processor can then re−configure the
FUSB303 to the desired mode and clear the global interrupt
mask bit, INT_MASK using the I
2
C interface. The
INT_N/OUT3 pin is an active LOW, open drain output. This
pin indicates to the host processor that an interrupt has
occurred in the FUSB303 which needs attention. The
INT_N/OUT3 pin is in a high impedance state by default
after power−up or device reset, and the global interrupt mask
(INT_MASK in Control register) is set. After INT_MASK
bit is cleared by the local processor, the INT_N/OUT3 pin
stays high impedance in preparation of future interrupts.
When an interruptible event occurs, INT_N/OUT3 is driven
LOW and is in a high impedance state again when the
processor clears the interrupt by writing a one in the position
of the interrupt bit that was set. Subsequent to the initial
power up or reset; if the processor writes a “1” to global
interrupt mask bit when the system is already powered up,
the INT_N/OUT3 pin stays in a high impedance state and
ignores all interrupts until the global interrupt mask bit
is cleared. If an event happens that would ordinarily cause
an interrupt when the global interrupt mask bit is set, the
INT_N/OUT3 pin goes LOW when the global interrupt
mask is cleared.
Interrupt bits hold their value and to clear a specific
interrupt, a “1” needs to be written to that interrupt bit.
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8
I
2
C Address
The ADDR/ORIENT bit HIGH or LOW is indicated in bit
5 of the slave address shown in Table 4.
Table 4. FUSB303 I
2
C SLAVE ADDRESS
Name Size (Bits) Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Slave Address 8 0 1 ADDR/ORIENT
state
0 0 0 1 R/W
Table 5. ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min. Max. Unit
V
VDD
Supply Voltage from V
DD
−0.5 6.0 V
V
CON
ID, VBUS_DET, CC1 and CC2 voltage −0.5 28.0 V
V
IO
PORT/DEBUG_N, ADDR/ORIENT, INT_N/OUT3, SDA/OUT1, SCL/OUT2 pins voltage −0.5 6.0 V
V
IO
EN_N −0.5 2.0 V
T
STORAGE
Storage Temperature Range −65 +150 C
T
J
Maximum Junction Temperature +150 C
T
L
Lead Temperature (Soldering, 10 seconds) +260 C
ESD IEC 61000−4−2 System ESD with external TVS
Connector
Pins (VBUS,
CC1 & CC2)
Air Gap 15
kV
Contact 8
Human Body Model, JEDEC JESD22−A114
Connector Pins
(VBUS_DET, CC1 and CC2)
4
kV
Others 2
Charged Device Model, JEDEC LESD22−C101 All Pins 1
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 6. RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min. Typ. Max. Unit
V
BUS
VBUS_DET Voltage 4.0 5.0 22 V
V
DD
Supply Voltage 2.85 3.3 5.5 V
T
A
Operating Temperature −40 +85 C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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9
Table 7. DC AND TRANSIENT CHARACTERISTICS
(Unless otherwise specified: Recommended T
A
and T
J
temperature ranges. All typical values are at T
A
= 25°C and V
DD
= 3.3 V unless
otherwise specified.)
Symbol
Parameter
T
A
= −40 to +85°C
T
J
=−40 to +125°C
Unit
Min. Typ. Max
TYPE C SPECIFIC PARAMETERS
I
80_CCX
Source 80 A CC Current (Default) HOST_CUR1 = 0, HOST_CUR0 = 1 or
via GPIO mode
64 80 96
A
I
180_CCX
Source 180 A CC Current (1.5 A) HOST_CUR1 = 1, HOST_CUR0 = 0 or
via GPIO mode
166 180 194
A
I
330_CCX
Source 330 A CC Current (3 A) HOST_CUR1 = 1, HOST_CUR0 = 1 or via
GPIO mode (Note 3)
304 330 356
A
V
SNKDB
Sink Pull−Down Voltage in Dead Battery Under all Pull−up Source Loads 2.18 V
Rd Sink Pull−Down Resistance when VDD is within Operating Range 4.6 5.1 5.6
k
zOPEN CC Resistance for Disabled State 126
k
vRa−SRCdef Ra Detection Threshold for CC Pin for Source for Default Current on VBUS
(HOST_CUR1/0 = 01) or via GPIO mode
0.15 0.20 0.25 V
vRa−SRC1.5A Ra Detection Threshold for CC Pin for Source for 1.5 A Current on VBUS
(HOST_CUR1/0 = 10) or via GPIO mode
0.35 0.40 0.45 V
vRa−SRC3A Ra Detection Threshold for CC Pin for Source for 3 A Current on VBUS
(HOST_CUR1/0 = 11) or via GPIO mode
0.75 0.80 0.85 V
vRd−SRCdef Rd Detection Threshold for Source for Default Current
(HOST_CUR1/0 = 01) or via GPIO mode
1.50 1.60 1.65 V
vRd−SRC1.5A Rd Detection Threshold for Source for 1.5 A Current (HOST_CUR1/0 = 10)
or via GPIO mode
1.50 1.60 1.65 V
vRd−SRC3A Rd Detection Threshold for Source for 3 A Current (HOST_CUR1/0 = 11) or
via GPIO mode (Note 3)
2.45 2.60 2.75 V
vRa−SNK Ra Detection Threshold for CC Pin for Sink 0.15 0.20 0.25 V
vRd−def Rd Default Current Detection Threshold for Sink 0.61 0.66 0.70 V
vRd−1.5A Rd 1.5 A Current Detection Threshold for Sink 1.16 1.23 1.31 V
vRd−3.0A Rd 3 A Current Detection Threshold for Sink 2.04 2.11 2.18 V
vVBUSthr VBUS_DET Threshold when VBUSOK is deasserted 2.9 3.3 3.67 V
vVBUSdeb VBUS_DET debounce time before VBUSOK is deasserted only
(see tDeb below for VBUSOK being asserted)
10 20 ms
vVBthLH VBUS_DET Threshold when VBUSOK is asserted 3.67 4.07 4.48 V
tDeb VBUS_DET debounce time before VBUSOK is asserted 250 500
s
vVSAFEthr vSafe0V VBUS_DET Threshold 0.8 V
vVSAFEthrhys VSAFE0V VBUS_DET Threshold hysteresis 50 mV
rVBUSleak Leakage between VBUS and GND when VBUS not sourced 72.4
k
rVBUSdschg
Effective resistance from VBUS and GND when VBUS is being discharged
from vSafe5V
V
DD
(V) = 2.85 to 5.5
2 kΩ
rPullup
Pull up resistor to VDD value on EN_N pin
V
DD
(V) = 2.85 to 5.5
6 MΩ
vAUTOSNKthr
Weak Battery VDD Threshold
−3%
AUTO
SNK_T
H
+3% V
Ra
Resistor for discharging VCONN
V
DD
(V) = 2.85 to 5.5
1 kΩ
3. VDD = 3 V when 3 A current advertised.

FUSB303TMX

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
USB Interface IC USB-C PORT CONT
Lifecycle:
New from this manufacturer.
Delivery:
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