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FN6831.0
February 4, 2009
ISL62386
Thin Quad Flat No-Lead Plastic Package (TQFN)
Thin Micro Lead Frame Plastic Package (TMLFP)
INDEX
D/2
D
E/2
E
A
B
C
0.10 BAMC
A
N
SEATING PLANE
N
6
3
2
2
3
e
1
1
0.08
SECTION "C-C"
NX b
A1
2X
C
0.15
0.15
2X
B
REF.
(Nd-1)Xe
(Ne-1)Xe
REF.
5
A1
A
C
C
A3
D2
D2
E2
E2/2
SIDE VIEW
TOP VIEW
7
BOTTOM VIEW
7
5
2
NX k
NX b
8
NX L
8
8
AREA
0.10
C
/ /
(DATUM B)
(DATUM A)
AREA
INDEX
6
AREA
N
L32.5x5A
32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220WJJD-1 ISSUE C)
SYMBOL
MILLIMETERS
NOTESMIN NOMINAL MAX
A 0.70 0.75 0.80 -
A1 - - 0.05 -
A3 0.20 REF -
b 0.18 0.25 0.30 5, 8
D 5.00 BSC -
D2 3.30 3.45 3.55 7, 8
E 5.00 BSC -
E1 5.75 BSC 9
E2 3.30 3.45 3.55 7, 8
e 0.50 BSC -
k0.20 - - -
L 0.30 0.40 0.50 8
N322
Nd 8 3
Ne 8 3
Rev. 2 05/06
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5m-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land Pattern
Design efforts, see Intersil Technical Brief TB389.
