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4
SWITCHING CHARACTERISTICS (Type 5) (C
L
= 50 pF, T
A
= 25_C)
Characteristic Symbol V
DD
Min
Typ
(Note 6)
Max Unit
Output Rise Time
t
TLH
= (3.0 ns/pF) C
L
+ 30 ns
t
TLH
= (1.5 ns/pF) C
L
+ 15 ns
t
TLH
= (1.1 ns/pF) C
L
+ 10 ns
t
TLH
5.0
10
15
180
90
65
360
180
130
ns
Output Fall Time
t
THL
= (1.5 ns/pF) C
L
+ 25 ns
t
THL
= (0.75 ns/pF) C
L
+ 12.5 ns
t
THL
= (0.55 ns/pF) C
L
+ 9.5 ns
t
THL
5.0
10
15
100
50
40
200
100
80
ns
Propagation Delay Time
t
PLH
, t
PHL
= (1.7 ns/pF) C
L
+ 5 ns
t
PLH
, t
PHL
= (0.66 ns/pF) C
L
+ 17 ns
t
PLH
, t
PHL
= (0.5 ns/pF) C
L
+ 15 ns
t
PLH
,
t
PHL
5.0
10
15
90
50
40
180
100
80
ns
5. The formulas given are for the typical characteristics only at 25_C.
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Switching Time Test Circuits and Waveforms
PULSE
GENERATOR
PULSE
GENERATOR
INPUT
2
INPUT
15
V
DD
V
DD
16
16
8
8V
SS
V
SS
C
L
C
L
1
13
OUTPUT
OUTPUT
PULSE
GENERATOR
INPUT
7
V
DD
16
5
OUTPUT
8V
SS
C
L
6
20 ns 20 ns
V
DD
V
SS
V
OH
V
OL
t
r
t
f
90%
50%
10%
90%
50%
10%
90%
50%
10%
90%
10%
50%
INPUT
OUTPUT
t
PHL
t
PLH
14
MC14572UB
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5
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
18
916
K
PLANE
−T−
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
F 0.040 0.70 1.02 1.77
G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
J 0.008 0.015 0.21 0.38
K 0.110 0.130 2.80 3.30
L 0.295 0.305 7.50 7.74
M 0 10 0 10
S 0.020 0.040 0.51 1.01
____
PDIP−16
CASE 648−08
ISSUE T
SOIC−16
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
R
X 45
_
G
8 PLP
−B−
−A−
M
0.25 (0.010) B
S
−T−
D
K
C
16 PL
S
B
M
0.25 (0.010) A
S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 9.80 10.00 0.386 0.393
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.054 0.068
D 0.35 0.49 0.014 0.019
F 0.40 1.25 0.016 0.049
G 1.27 BSC 0.050 BSC
J 0.19 0.25 0.008 0.009
K 0.10 0.25 0.004 0.009
M 0 7 0 7
P 5.80 6.20 0.229 0.244
R 0.25 0.50 0.010 0.019
____
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6
PACKAGE DIMENSIONS
SOEIAJ−16
CASE 966−01
ISSUE A
H
E
A
1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 0.78 −−− 0.031
A
1
H
E
Q
1
L
E
_
10
_
0
_
10
_
L
E
Q
1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005)
0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
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MC14572UBCPG

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Logic Gates 3-18V CMOS Hex Gate
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