DLP11SN121SL2L

Spec No. JEFL243E-0004W P7/9
MURATA MFG.CO., LTD
Reference Only
Pick- up nozzle
Support pin
P.C.B.
Product
(2) Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as
possible to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as
with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore
A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs
during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
16.5 Attention Regarding P.C.B. Design
< The Arrangement of Products >
P.C.B. shall be designed so that products are
far from the portion of perforation.
The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the
case of P.C.B. separation.
Products shall not be arranged on the line
of a series of holes when there are big
holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
Support pins shall be set under P.C.B .
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B.
< P.C.B. Separation >
P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
16.6 Attention Regarding P.C.B. Mounting
In case of mounting by use of mounting machine, please choose nozzle which can pick up
components of 1005 size or the equivalents.
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Product
P.C.B.
Hole
×
Perforation
A
B
C
D
Screw Hole
Recommended
Spec No. JEFL243E-0004W P8/9
MURATA MFG.CO., LTD
Reference Only
0.55
0.85
0.30
0.55
1.95
*(1)(2)(3)(4)Indicates terminal number
Resist
Copper foil pattern
No pattern
(in : mm)
(1) (2)
(4) (3)
16.7 Standard Land Dimensions
16.8 Soldering(Reflow soldering)
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C10s
Cycle of reflow 2 times 2 times
(1) Standard printing pattern of solder paste
Standard thickness of the solder paste should be 100 to 150µm.
Use the solder paste printing pattern of the right pattern.
For the resist and copper foil pattern, use standard land dimensions.
Use Sn-3.0Ag-0.5Cu solder.
(2) Reworking with Soldering iron
The following conditions shall be strictly followed when using a soldering iron after
being mounted by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 380°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) s. · Times : 2times max.
Do not touch the products directly with the tip of the soldering iron.
(3) Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Excessive solder volume may cause the failure of mechanical or electrical performance.
Standard Profile
Limit Profile
Temp.
Time
90s±30s
230
260
245℃±3
220℃
30s60s
60s max.
180
150
(s)
(℃)
(inmm)
0.55
0.30
0.70
0.55
0.70
U
pp
er Limit
Recommendable
1/3 T TT : Chip thickness
t
Recommendable
U
pp
er Limit
Spec No. JEFL243E-0004W P9/9
MURATA MFG.CO., LTD
Reference Only
16.9 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B..
Power : 20W/ l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alternative cleaner Isopropyl alcohol (IPA)
2. Aqueous agent PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized
water in order to remove the cleaner.
(5) Other cleaning
Please contact us.
16.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
16.11 Operating Environment
Do not use this product under the following environmental conditions, on deterioration
of the performance, such as insulation resistance may result from the use.
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
16.12 Storage Conditions
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment condition
Products should be stored in the warehouse on the following conditions.
Temperature : -10 to +40°C
Humidity : 15 to 85% relative humidity
No rapid change on temperature and humidity
Products should not be stored in corrosive gases, such as sulfureous, acid gases,alkaline gases,to
prevent the following deterioration.
Poor solderability due to the oxidized electrode.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
17.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

DLP11SN121SL2L

Mfr. #:
Manufacturer:
Description:
Common Mode Filters / Chokes 0504 5volt DCR 2.0ohm +/-25%
Lifecycle:
New from this manufacturer.
Delivery:
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