8735AY-01 www.idt.com REV. G NOVEMBER 12, 2010
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ICS8735-01
1:5 DIFFERENTIAL-TO-3.3V LVPECL
ZERO DELAY CLOCK GENERATOR
The following component footprints are used in this layout
example:
All the resistors and capacitors are size 0603.
POWER AND GROUNDING
Place the decoupling capacitors C1, C6, C2, C4, C5, and C7,
as close as possible to the power pins. If space allows, place-
ment of the decoupling capacitor on the component side is
preferred. This can reduce unwanted inductance between the
decoupling capacitor and the power pin caused by the via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power
and ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed
as close to the V
CCA
pin as possible.
CLOCK TRACES AND TERMINATION
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital sys-
tems, the clock signal is less tolerant to poor signal integrity
than other signals. Any ringing on the rising or falling edge
or excessive ring back can cause system failure. The shape
of the trace and the trace delay might be restricted by the
available space on the board and the component location.
While routing the traces, the clock signal traces should be routed
first and should be locked prior to routing other signal traces.
The differential 50Ω output traces should have same
length.
Avoid sharp angles on the clock trace. Sharp angle
turns cause the characteristic impedance to change on
the transmission lines.
Keep the clock traces on the same layer. Whenever pos-
sible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Make sure no other signal traces are routed between the
clock trace pair.
The matching termination resistors should be located as
close to the receiver input pins as possible.
FIGURE 5B. PCB BOARD LAYOUT FOR ICS8735-01
GND
C7
C16
VCCA
VIA
U1
VCC
C4
50 Ohm
Traces
C1
C6
VCCO
R7
C5
C2
Pin 1
C11
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1:5 DIFFERENTIAL-TO-3.3V LVPECL
ZERO DELAY CLOCK GENERATOR
POWER CONSIDERATIONS
This section provides information on power dissipation and junction temperature for the ICS8735-01.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the ICS8735-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for V
CC
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
CC_MAX
* I
EE_MAX
= 3.465V * 150mA = 520mW
Power (outputs)
MAX
= 30mW/Loaded Output pair
If all outputs are loaded, the total power is 5 * 30mW = 150mW
Total Power
_MAX
(3.465V, with all outputs switching) = 520mW + 150mW = 670mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the
device. The maximum recommended junction temperature for the devices is 125°C.
The equation for Tj is as follows: Tj = θ
JA
* Pd_total + T
A
Tj = Junction Temperature
θ
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance θ
JA
must be used
. Assuming a
moderate air flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 42.1°C/W per Table 7A below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.670W * 42.1°C/W = 98.2°C. This is well below the limit of 125°C
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow,
and the type of board (single layer or multi-layer).
θθ
θθ
θ
JA
by Velocity (Linear Feet per Minute)
0 200 500
Single-Layer PCB, JEDEC Standard Test Boards 67.8°C/W 55.9°C/W 50.1°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 47.9°C/W 42.1°C/W 39.4°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.
TABLE 7A. THERMAL RESISTANCE
θθ
θθ
θ
JA
FOR 32-PIN LQFP, FORCED CONVECTION
TABLE 7B.
θθ
θθ
θ
JA
VS. AIR FLOW TABLE FOR 32 LEAD VFQFN PACKAGE
θθ
θθ
θ
JA
0 Air Flow (Linear Feet per Minute)
0
Multi-Layer PCB, JEDEC Standard Test Boards 34.8C/W
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1:5 DIFFERENTIAL-TO-3.3V LVPECL
ZERO DELAY CLOCK GENERATOR
3. Calculations and Equations.
The purpose of this section is to derive the power dissipated into the load.
LVPECL output driver circuit and termination are shown in
Figure 6.
To calculate worst case power dissipation into the load, use the following equations which assume a 50Ω load, and a termination
voltage of V
CCO
- 2V.
For logic high, V
OUT
= V
OH_MAX
= V
CCO_MAX
– 0.9V
(V
CCO_MAX
- V
OH_MAX
)
= 0.9V
For logic low, V
OUT
= V
OL_MAX
= V
CCO_MAX
– 1.7V
(V
CCO_MAX
- V
OL_MAX
)
= 1.7V
Pd_H is power dissipation when the output drives high.
Pd_L is the power dissipation when the output drives low.
Pd_H = [(V
OH_MAX
– (V
CCO_MAX
- 2V))/R
L
] * (V
CCO_MAX
- V
OH_MAX
) = [(2V - (V
CCO_MAX
- V
OH_MAX
))
/R
L
] * (V
CCO_MAX
- V
OH_MAX
) =
[(2V - 0.9V)/50Ω] * 0.9V = 19.8mW
Pd_L = [(V
OL_MAX
– (V
CCO_MAX
- 2V))/R
L
] * (V
CCO_MAX
- V
OL_MAX
) = [(2V - (V
CCO_MAX
- V
OL_MAX
))
/R
L
] * (V
CCO_MAX
- V
OL_MAX
) =
[(2V - 1.7V)/50Ω] * 1.7V = 10.2mW
Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW
FIGURE 6. LVPECL DRIVER CIRCUIT AND TERMINATION
Q1
V
OUT
V
CCO
RL
50
V
CCO
- 2V

8735AYI-01LF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Generators & Support Products 5 LVPECL OUT DIVIDER
Lifecycle:
New from this manufacturer.
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