DATA SHEET • SMP1371-087LF SURFACE MOUNT PIN DIODE
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com
2 May 31, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 201289B
Table 1. SMP1371-087LF Absolute Maximum Ratings
Parameter Symbol Minimum Maximum Units
Forward current IF 200 mA
Reverse voltage VR 35 V
Dissipated power @ 85 °C PD 1 W
Operating temperature TA –40 +85 °C
Storage temperature TSTG –55 +200 °C
Junction temperature TJ –55 +175 °C
Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device
must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body
or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 2. SMP1371-087LF Electrical Specifications (Note 1)
(T
A = +25 °C, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)
Parameter Symbol Test Condition Min Typical Max Units
Forward voltage VF IF = 50 mA 1.0 V
Reverse leakage current IR V
R
= 35 V 10 μA
Series resistance RS IF = 10 mA, f = 100 MHz 0.5 Ω
Total capacitance CT20 V
R
= 20 V, f = 1 MHz 1.2 pF
Minority carrier lifetime TL IF = 10 mA 200 ns
Parallel resistance RP V
R
= 0 V, f = 100 MHz 2.5 kΩ
I region width W 12 μm
Thermal resistance (Note 2) ΘJC 116 °C/W
Note 1: Performance is guaranteed only under the conditions listed in this Table.
Note 2: Assume a thermal resistance of 92 °C/W for the junction-to-bottom of circuit board.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SMP1371-087LF are
provided in Table 1. Electrical specifications are provided in
Table 2.
Typical performance characteristics of the SMP1371-087LF are
illustrated in Figures 1, 2, and 3.
Package Dimensions
The PCB layout footprint for the SMP1371-087LF is provided in
Figure 4. Typical case markings are shown in Figure 5. Package
dimensions for the SMP1371-087LF are provided in Figure 6,
and tape and reel dimensions are provided in Figure 7.
Package and Handling Information
Instructions on the shipping container label regarding exposure
to moisture after the container seal is broken must be followed.
Otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The SMP1371-087LF is rated to Moisture Sensitivity Level 1
(MSL1) at 260 °C. It can be used for lead or lead-free soldering.
For additional information, refer to the Skyworks Application
Note, Solder Reflow Information, document number 200164.
Care must be taken when attaching this product, whether it is
done manually or in a production solder reflow environment.
Production quantities of this product are shipped in a standard
tape and reel format. For packaging details, refer to the
Skyworks Application Note, Discrete Devices and IC
Switch/Attenuators Tape and Reel Package Orientation,
document number 200083.
