Package information TS274
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5 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
5.1 DIP14 package information
Figure 15. DIP14 package mechanical drawing
Table 5. DIP14 package mechanical data
Ref.
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
a1 0.51 0.020
B 1.39 1.65 0.055 0.065
b0.5 0.020
b1 0.25 0.010
D200.787
E8.5 0.335
e 2.54 0.100
e3 15.24 0.600
F 7.1 0.280
I 5.1 0.201
L3.3 0.130
Z 1.27 2.54 0.050 0.100
