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LAA110S

P1-P3P4-P6P7-P7
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
4
R11
LAA110
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
On-Resistance (:)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Single Pole
Dual Pole
I
F
=5mA
I
F
=10mA
I
F
=5mA
I
F
=10mA
Temperature (ºC)
Typical On-Resistance vs. Temperature
(I
L
=120mA
DC
)
I
F
=5mA
I
F
=10mA
I
F
=20mA
Turn-On (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Turn-On vs. Temperature
(I
L
=50mA
DC
)
Temperature (ºC)
Turn-Off (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100 120
I
F
=5mA
Temperature (ºC)
Typical Turn-Off vs. Temperature
(I
L
=50mA
DC
)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
On-Resistance (:)
Typical On-Resistance vs. Temperature
(I
L
=50mA
DC
Instantaneous, I
F
=5mA)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical I
F
for Switch Operation
vs. Temperature
(I
L
=50mA
DC
)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical I
F
for Switch Dropout
vs. Temperature
(I
L
=50mA
DC
)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-3 -2 -1 0 1 2 3
Typical Load Current vs. Load Voltage
(I
F
=5mA)
Blocking Voltage (V
P
)
Temperature (ºC)
-40
430
425
420
415
410
405
400
395
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
435
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
(V
L
=350V)
Temperature (ºC)
Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms
1s
10ms 10s 100s
Energy Rating Curve
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
=10mA
I
F
=5mA
I
F
=10mA
I
F
=5mA
Single Pole
Dual Pole
Maximum Load Current
vs. Temperature
I
NTEGRATED
C
IRCUITS
D
IVISION
LAA110
www.ixysic.com
5
R11
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LAA110 / LAA110S / LAA110P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LAA110 / LAA110S 250ºC for 30 seconds
LAA110P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
e
3
Pb
I
NTEGRATED
C
IRCUITS
D
IVISION
www.ixysic.com
6
R11
LAA110
MECHANICAL DIMENSIONS
LAA110
LAA110S
LAA110P
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
P1-P3P4-P6P7-P7

LAA110S

Mfr. #:
Buy LAA110S
Manufacturer:
IXYS Integrated Circuits
Description:
Solid State Relays - PCB Mount DPST-NO/NO 8PIN DIP
Lifecycle:
New from this manufacturer.
Delivery:
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