3-Lead Plastic Small Outline Transistor (TT or NB) [SOT-23]
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units MILLIMETERS
Dimension Limits MIN NOM MAX
Number of Pins N 3
Lead Pitch e 0.95 BSC
Outside Lead Pitch e1 1.90 BSC
Overall Height A 0.89 – 1.12
Molded Package Thickness A2 0.79 0.95 1.02
Standoff A1 0.01 – 0.10
Overall Width E 2.10 – 2.64
Molded Package Width E1 1.16 1.30 1.40
Overall Length D 2.67 2.90 3.05
Foot Length L 0.13 0.50 0.60
Foot Angle φ 0° – 10°
Lead Thickness c 0.08 – 0.20
Lead Width b 0.30 – 0.54
b
N
E
E1
2
1
e
e1
D
A
A1
A2
c
L
φ
Microchip Technology Drawing C04-104B
