Document Number: 20004 For technical questions, contact: melf@vishay.com
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Revision: 16-Sep-11 35
SMM0204
Thin Film Mini-MELF Resistors
Vishay Draloric
This document is subject to change without notice.
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Note
(1)
For resistance > 2M21: ± (2.0 % R + 0.05 ).
TEST PROCEDURES AND REQUIREMENTS
TEST CONDITIONS OF TEST
REQUIREMENTS PERMISSIBLE CHANGE (R)
STABILITY
CLASS 0.25
STABILITY
CLASS 0.5
STABILITY
CLASS 1
STABILITY
CLASS 2
10 to 332 k 1 to 10 < 1 > 332 k
Endurance test at 70 °C
IEC 60115-1, 4.25.1
U = U
max.
;
1.5 h “on”, 0.5 h “off”
at 70 °C, 1000 h ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
at 70 °C, 8000 h ± (0.5 % R + 0.05 ) ± (1.0 % R + 0.05 )
Endurance at UCT
IEC 60115-1, 4.25.3
at 125 °C, 1000 h ± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
Damp heat steady state
40 °C/93 % RH
IEC 60115-1, 4.24 and
IEC 60068-2-78
56 days;
U = 0.1 x ;
U
max.
= 20 V
± (0.25 % R + 0.05 ) ± (0.5 % R + 0.05 )
Damp heat steady state
accelerated 85 °C/85 % RH
1000 h;
U = 0.3 x ;
U
max.
= 40 V
± 1.0 % R + 0.05 )
(1)
Rapid change of temperature;
1000 cycles
IEC 60115-1, 4.19 and
IEC 60068-2-14
30 min at LCT;
30 min at UCT;
LCT = - 55 °C;
UCT = 125 °C
± (0.25 % R + 0.05 )
Overload test
IEC 60115-1, 4.13
U = 2.5 x 2 x U
max.
;
2 s
± (0.05 % R + 0.01 ) ± (0.1 % R + 0.05 )
Electrostatic discharge (HBM)
IEC 60340-3-1
3 positive + 3 negative
discharges 2 kV
± (0.5 % R + 0.05 )
Resistance to soldering heat
IEC 60115-1, 4.18.2 and
IEC 60068-2-58
Solder bath method
(260 ± 5) °C;
10 s
± (0.05 % R + 0.01 ) ± (0.1 % R + 0.05 )
APPLICABLE SPECIFICATIONS
• EN 60115-1 Generic specification
• EN 140400 Sectional specification
• EN 140401-803 Detail specification
• IEC 60068-2-x Variety of environmental test procedures
• IEC 60286-3 Packaging of SMD components