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STTH1602CGY-TR

P1-P3P4-P6P7-P9P10-P11
Characteristics
STTH1602C-Y
4/11
DocID031016 Rev 1
1.1 Characteristics (curves)
Figure 1: Average forward power dissipation
versus average forward current (square waveform)
Figure 2: Forward voltage drop versus forward
current (typical values)
Figure 3: Forward voltage drop versus forward
current (maximum values)
Figure 4: Relative variation of thermal impedance
junction to case versus pulse duration
Figure 5: Junction capacitance versus reverse
voltage applied (typical values, per diode)
Figure 6: Reverse recovery charges versus dI
F
/dt
(typical values, per diode)
0
2
4
6
8
10
0 1 2 3 4 5 6 7 8 9 10
I
F(AV)
(A)
P
F(AV)
(W)
δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 δ = 1
T
δ
=tp/T
tp
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0
V
F
(V)
I
F
(A)
T
j
= 25 °C
T
j
= 150 °C
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0 2.5
V
F
(V)
I
F
(A)
T
j
= 25 °C
T
j
= 150 °C
0.1
1.0
1.E-03 1.E-02 1.E-01 1.E+00
tp(s)
Zth
(j-c)
/Rth
(j-c)
Single pulse
D²PAK
10
100
1 10 100 1000
V
R
(V)
C(pF)
F = 1 MHz
V
osc
= 30 mV
RMS
T
j
= 25 °C
0
50
100
150
200
250
300
350
400
0 100 200 300 400 500
dI
F
/dt(A/µs)
Q
RR
(nC)
I
F
= 8 A
V
R
= 160 V
T
j
= 125 °C
T
j
= 25 °C
STTH1602C-Y
Characteristics
DocID031016 Rev 1
5/11
Figure 7: Reverse recovery time versus dI
F
/dt
(typical values, per diode)
Figure 8: Peak reverse recovery current versus
dI
F
/dt (typical values, per diode)
Figure 9: Softness factor versus dI
F
/dt (typical
values, per diode)
Figure 10: Dynamic parameters versus junction
temperature
Figure 11: Thermal resistance junction to ambient versus copper surface under tab
0
10
20
30
40
50
60
70
80
0 5 10 15 20 25 30 35 40
S
Cu
(cm²)
R
th(j-a)
(°C/W)
Epoxy printed board FR4, e
CU
= 35 µm
Package information
STTH1602C-Y
6/11
DocID031016 Rev 1
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL94,V0
P1-P3P4-P6P7-P9P10-P11

STTH1602CGY-TR

Mfr. #:
Buy STTH1602CGY-TR
Manufacturer:
STMicroelectronics
Description:
Rectifiers Automotive High efficiency ultrafast diode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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