DMN2400UFD
Document number: DS35475 Rev. 5 - 2
February 2015
© Diodes Incorporated
Maximum Ratings (@T
A
= +25°C unless otherwise specified.)
Continuous Drain Current (Note 6) V
GS
= 4.5V
Continuous Drain Current (Note 6) V
GS
= 2.5V
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Maximum Body Diode Forward Current (Note 6)
Thermal Characteristics (@T
A
= +25°C unless otherwise specified.)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics (@T
A
= +25°C unless otherwise specified.)
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current T
J
= +25°C
V
DS
= 4.5V, V
GS
= 0V
V
DS
= 20V, V
GS
= 0V
ON CHARACTERISTICS (Note 7)
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
Forward Transfer Admittance
DYNAMIC CHARACTERISTICS (Note 8)
V
DS
=16V, V
GS
= 0V,
f = 1.0MHz
Reverse Transfer Capacitance
V
GS
= 4.5V, V
DS
= 10V,
I
D
= 250mA
V
DD
= 10V, V
GS
= 4.5V,
R
L
= 47Ω, R
G
= 10Ω,
I
D
= 200mA
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1-inch square copper plate.
7 .Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.