2
IR2171/IR2172
www.irf.com
Symbol Definition Min. Max. Units
V
S
High side offset voltage -0.3 600
V
BS
High side floating supply voltage
-0.3 25
V
CC
Low side and logic fixed supply voltage -0.3 25
V
IN
Maximum input voltage between V
IN+ and
V
IN-
-5 5
V
PO
Digital PWM output voltage COM -0.3 VCC +0.3
V
OC
Overcurrent output voltage (IR2172) COM -0.3 VCC +0.3
V
IN-
V
IN-
input voltage (note 1) V
S
-5 V
B+ 0.3
dV/dt Allowable offset voltage slew rate — 50 V/ns
P
D
Package power dissipation @ T
A
≤ +25°C 8 lead SOIC — .625
8 lead PDIP — 1.0
Rth
JA
Thermal resistance, junction to ambient 8 lead SOIC — 200
8 lead PDIP — 125
T
J
Junction temperature — 150
T
S
Storage temperature -55 150
T
L
Lead temperature (soldering, 10 seconds) — 300
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM, all currents are defined positive into any lead. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions.
V
°C/W
W
Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The
external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins.
°C
Recommended Operating Conditions
The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recom-
mended conditions.
Symbol Definition Min. Max. Units
V
B
High side floating supply voltage V
S
+13.0 V
S
+20
V
S
High side floating supply offset voltage 0.3 600
V
PO
Digital PWM output voltage COM VCC
V
OC
Overcurrent output voltage COM VCC
V
CC
Low side and logic fixed supply voltage 9.5 20
V
IN
Input voltage between V
IN+
and V
IN-
-260 +260 mV
T
A
Ambient temperature -40 125
°C
V
