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Accu-Guard
®
SMD Thin-Film Fuse
QUALITY & RELIABILITY
Accu-Guard
®
series of fuses is based on established
thin-film technology and materials used in the semiconduc-
tor in dus try.
• In-line Process Control: This program forms an integral
part of the production cycle and acts as a feedback sys-
tem to regulate and control production processes. The
test procedures, which are integrated into the production
process, were developed after long research and are
based on the highly developed semiconductor industry
test pro ce dures and equip ment. These mea sures help
AVX/Kyocera to produce a consistent and high yield line
of products.
• Final Quality Inspection: Finished parts are tested for
standard electrical parameters and visual/mechanical
char ac ter is tics. Each production lot is 100% evaluated for
electrical resistance. In addition, each production lot is
eval u at ed on a sample basis for:
• Insulation resistance (post fusing)
• Blow time for 2 x rated current
• Endurance test: 125°C, rated current, 4 hours
HANDLING AND SOLDERING
SMD chips should be handled with care to avoid dam age
or contamination from perspiration and skin oils. The use
of plastic tipped tweezers or vacuum pick-ups is strongly
recommended for individual components. Bulk handling
should ensure that abrasion and mechanical shock are
minimized. For automatic equipment, taped and reeled
product is the ideal medium for direct presentation to the
placement machine.
CIRCUIT BOARD TYPE
All flexible types of circuit boards may be used
(e.g. FR-4, G-10).
For other circuit board materials, please consult factory.
COMPONENT PAD DESIGN
Component pads must be designed to achieve good joints
and minimize component movement during soldering.
Pad designs are given below for both wave and reflow
soldering.
The basis of these designs are:
a. Pad width equal to component width. It is per mis si ble to
decrease this to as low as 85% of component width but
it is not advisable to go be low this.
b. Pad overlap 0.5mm.
c. Pad extension 0.5mm for reflow. Pad ex ten sion about
1.0mm for wave soldering.
PREHEAT & SOLDERING
The rate of preheat in production should not exceed
4°C/second. It is recommended not to exceed 2°C/
sec ond.
Temperature differential from preheat to soldering should
not exceed 150°C.
For further specific application or process advice, please
consult AVX.
HAND SOLDERING & REWORK
Hand soldering is permissible. Preheat of the PCB to 100°C
is required. The most preferable technique is to use hot air
soldering tools. Where a soldering iron is used, a tem per a -
ture controlled model not exceeding 30 watts should be
used and set to not more than 260°C. Max i mum al lowed
time at tem per a ture is 1 minute.
COOLING
After soldering, the assembly should preferably be al lowed
to cool naturally. In the event of assisted cool ing, similar
con di tions to those rec om mend ed for pre heat ing should
be used.
REFLOW SOLDERING
Dimensions:
millimeters (inches)
0.
.
0.
0.
0.
