PIN FIN HEAT SINK
904 Series
ASSEMBLY INSTRUCTION:
STEP 1: Center heat Sink onto BGA. Tilt and
hook one side of the clip under the BGA chip.
STEP 2: Press down the other side of clip to
snap it onto the BGA chip.
STEP 3: Make sure the stop pin is not on top
of the chip set. Installation is now complete.
Wakefield-Vette’s heat sink
assembles onto chip set using
the space that is between the
PCB and the substrate of the
solder balls. The solder balls
provide a minimal gap of
.5mm to .7mm. Attachment
feature is below a .4mm
thickness. The clipping system
will not interfere or damage
chip. Contact area is the edge
of chip.
SHOCK TEST SPECIFICATION:
Wave Form :Half sine wave
Acceleration :50 g
Duration Time :11 ms
No. of Shock :Each axis 3 times
Shock Direction :±X, ±Y, ±Z axis
Reliability & Communication
Testing Instruments
Random Vibration Test
Frequency :5 Hz to 500 Hz
Acceleration :3.13 grms
P.S.D :0.01 g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis :X, Y, Z axis
Test Time :10 mins (Each axis)
Total Test Time :30 mins
Thermal Solutions from Smart to Finish
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