CM1214A-01SO

CM1214A
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7
APPLICATION INFORMATION (Cont’d)
IEEE1394
GND
GALV
ISO
LLCPHY
CM1214A02 CM1214A02
Keep the ESD devices on the PHY side of the galvanic isolation and inside the V
CC
domain of the PHY controller
Figure 9. Typical Application IEEE1394 Protection,
CM1214A02MR in 8lead MSOP
CM1214A
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8
PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AR
D
A1
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
e
E
E
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1
0.01 0.06 0.10 0.000
b 0.37 0.44 0.50 0.015
c 0.08 0.14 0.20 0.003
D 2.80 2.90 3.04 0.110
E 1.20 1.30 1.40 0.047
e 1.78 1.90 2.04 0.070
L
0.30 0.43 0.55 0.012
0.039 0.044
0.002 0.004
0.017 0.020
0.006 0.008
0.114 0.120
0.051 0.055
0.075 0.080
0.017 0.022
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
H
E
0.35 0.54 0.69 0.014 0.021 0.027
c
0 −−− 10 0 −−− 10
T
____
T
3X
TOP VIEW
SIDE VIEW
END VIEW
2.90
0.80
DIMENSIONS: MILLIMETERS
0.90
PITCH
3X
3X
0.95
RECOMMENDED
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
CM1214A
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9
PACKAGE DIMENSIONS
MSOP 8, 3x3
CASE 846AD
ISSUE O
E1E
A2
A1 e b
D
c
A
TOP VIEW
SIDE VIEW
END VIEW
L1
L2
L
DETAIL A
DETAIL A
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-187.
SYMBOL
MIN NOM MAX
q
θ
A
A1
A2
b
c
D
E
E1
e
L
L2
0.05
0.75
0.22
0.13
0.40
2.90
4.80
2.90
0.65 BSC
0.25 BSC
1.10
0.15
0.95
0.38
0.23
0.80
3.10
5.00
3.10
0.60
3.00
4.90
3.00
L1 0.95 REF
0.10
0.85
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CM1214A-01SO

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ON Semiconductor
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TVS Diodes / ESD Suppressors 1-ch. PicoGuard for
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