STPS2L40 Characteristics
5/10
Figure 13. Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 14. Junction capacitance versus
reverse voltage applied (typical
values)
Figure 15. Forward voltage drop versus
forward current (high level)
Figure 16. Forward voltage drop versus
forward current (low level)
I (mA)
R
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0 5 10 15 20 25 30 35 40
T
j
=125°C
T
j
=25°C
V (V)
R
10
100
1000
1 10 100
C(pF)
V (V)
R
F=1MHz
V =30mV
T =25°C
OSC RMS
j
0.1
1.0
10.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
I (A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maxmimum values)
j
T =125°C
(typical values)
j
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.1 0.2 0.3 0.4 0.5 0.6
I (A)
FM
V (V)
FM
T =25°C
(maximum values)
j
T =125°C
(maxmimum values)
j
T =125°C
(typical values)
j
Figure 17. Thermal resistance junction to
ambient versus copper surface
under each lead, SMB, SMBflat
(epoxy printed board FR4, copper
thickness = 35 µm)
Figure 18. Thermal resistance junction to
ambient versus copper surface
under each lead, SMAflat (epoxy
printed board FR4, copper
thickness = 35 µm)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
S (cm²)
CU
SMB
R (°C/W)
th(j-a)
SMBflat
0
20
40
60
80
100
120
140
160
180
200
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
SMAflat
S (cm²)
CU
R (°C/W)
th(j-a)
