TK72E08N1,S1X

TK72E08N1
1
MOSFETs Silicon N-channel MOS (U-MOS-H)
TK72E08N1
TK72E08N1
TK72E08N1
TK72E08N1
Start of commercial production
2012-05
1.
1.
1.
1. Applications
Applications
Applications
Applications
Switching Voltage Regulators
2.
2.
2.
2. Features
Features
Features
Features
(1) Low drain-source on-resistance: R
DS(ON)
= 3.6 m (typ.) (V
GS
= 10 V)
(2) Low leakage current: I
DSS
= 10 µA (max) (V
DS
= 80 V)
(3) Enhancement mode: V
th
= 2.0 to 4.0 V (V
DS
= 10 V, I
D
= 1.0 mA)
3.
3.
3.
3. Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
Packaging and Internal Circuit
TO-220
1: Gate
2: Drain (heatsink)
3: Source
4.
4.
4.
4. Absolute Maximum Ratings (Note) (T
Absolute Maximum Ratings (Note) (T
Absolute Maximum Ratings (Note) (T
Absolute Maximum Ratings (Note) (T
a
a
a
a
= 25
= 25
= 25
= 25
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
Characteristics
Drain-source voltage
Gate-source voltage
Drain current (DC)
Drain current (DC)
Drain current (pulsed)
Power dissipation
Single-pulse avalanche energy
Avalanche current
Channel temperature
Storage temperature
(Silicon limit)
(t = 1 ms)
(T
c
= 25)
(Note 1), (Note 2)
(Note 1), (Note 3)
(Note 1)
(Note 4)
Symbol
V
DSS
V
GSS
I
D
I
D
I
DP
P
D
E
AS
I
AR
T
ch
T
stg
Rating
80
±20
157
72
344
192
161
72
150
-55 to 150
Unit
V
A
W
mJ
A
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
2014-06-30
Rev.4.0
TK72E08N1
2
5.
5.
5.
5. Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Thermal Characteristics
Characteristics
Channel-to-case thermal resistance
Channel-to-ambient thermal resistance
Symbol
R
th(ch-c)
R
th(ch-a)
Max
0.65
83.3
Unit
/W
Note 1: Ensure that the channel temperature does not exceed 150.
Note 2: Limited by silicon chip capability. Package limit is 100 A.
Note 3: Device mounted with heatsink so that R
th(ch-a)
becomes 2.77/W.
Note 4: V
DD
= 64 V, T
ch
= 25 (initial), L = 24.0 µH, I
AR
= 72 A
Note: This transistor is sensitive to electrostatic discharge and should be handled with care.
2014-06-30
Rev.4.0
TK72E08N1
3
6.
6.
6.
6. Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics
6.1.
6.1.
6.1.
6.1. Static Characteristics (T
Static Characteristics (T
Static Characteristics (T
Static Characteristics (T
a
a
a
a
= 25
= 25
= 25
= 25
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
Characteristics
Gate leakage current
Drain cut-off current
Drain-source breakdown voltage
Drain-source breakdown voltage
Gate threshold voltage
Drain-source on-resistance
(Note 5)
Symbol
I
GSS
I
DSS
V
(BR)DSS
V
(BR)DSX
V
th
R
DS(ON)
Test Condition
V
GS
= ±20 V, V
DS
= 0 V
V
DS
= 80 V, V
GS
= 0 V
I
D
= 10 mA, V
GS
= 0 V
I
D
= 10 mA, V
GS
= -20 V
V
DS
= 10 V, I
D
= 1.0 mA
V
GS
= 10 V, I
D
= 36 A
Min
80
60
2.0
Typ.
3.6
Max
±0.1
10
4.0
4.3
Unit
µA
V
m
Note 5: If a reverse bias is applied between gate and source, this device enters V
(BR)DSX
mode. Note that the drain-
source breakdown voltage is lowered in this mode.
6.2.
6.2.
6.2.
6.2. Dynamic Characteristics (T
Dynamic Characteristics (T
Dynamic Characteristics (T
Dynamic Characteristics (T
a
a
a
a
= 25
= 25
= 25
= 25
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
Characteristics
Input capacitance
Reverse transfer capacitance
Output capacitance
Gate resistance
Switching time (rise time)
Switching time (turn-on time)
Switching time (fall time)
Switching time (turn-off time)
Symbol
C
iss
C
rss
C
oss
r
g
t
r
t
on
t
f
t
off
Test Condition
V
DS
= 40 V, V
GS
= 0 V, f = 1 MHz
See Figure 6.2.1
Min
Typ.
5500
38
1300
3.2
19
42
28
93
Max
Unit
pF
ns
Fig.
Fig.
Fig.
Fig. 6.2.1
6.2.1
6.2.1
6.2.1 Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
Switching Time Test Circuit
6.3.
6.3.
6.3.
6.3. Gate Charge Characteristics (T
Gate Charge Characteristics (T
Gate Charge Characteristics (T
Gate Charge Characteristics (T
a
a
a
a
= 25
= 25
= 25
= 25
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
unless otherwise specified)
Characteristics
Total gate charge (gate-source plus
gate-drain)
Gate-source charge 1
Gate-drain charge
Gate switch charge
Symbol
Q
g
Q
gs1
Q
gd
Q
SW
Test Condition
V
DD
64 V, V
GS
= 10 V, I
D
= 72 A
Min
Typ.
81
29
21
33
Max
Unit
nC
2014-06-30
Rev.4.0

TK72E08N1,S1X

Mfr. #:
Manufacturer:
Toshiba
Description:
MOSFET 80V N-Ch PWR FET 157A 192W 81nC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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