NB7V586MMNR4G

© Semiconductor Components Industries, LLC, 2008
September, 2008 Rev. 0
1 Publication Order Number:
NB7V586M/D
NB7V586M
1.8V Differential 2:1 Mux
Input to 1.2V/1.8V 1:6 CML
Clock/Data Fanout Buffer /
Translator
MultiLevel Inputs w/ Internal Termination
Description
The NB7V586M is a differential 1to6 CML Clock/Data
Distribution chip featuring a 2:1 Clock/Data input multiplexer with an
input select pin. The INx/INx
inputs incorporate internal 50 W
termination resistors and will accept differential LVPECL, CML, or
LVDS logic levels (see Figure 12). The INx/INx
inputs and core logic
are powered with a 1.8 V supply. The NB7V586M produces six
identical differential CML output copies of Clock or Data. The outputs
are configured as three banks of two differential pair. Each bank (or all
three banks) have the flexibility of being powered by any combination
of either a 1.8 V or 1.2 V supply.
The 16 mA differential CML output structure provides matching
internal 50 W source terminations and 400 mV output swings when
externally terminated with a 50 W resistor to V
CCO
x (see Figure 11).
The 1:6 fanout design was optimized for low output skew and
minimal jitter and is ideal for SONET, GigE, Fiber Channel,
Backplane and other Clock/Data distribution applications operating
up to 6 GHz or 10 Gb/s typical. The V
REFAC
reference outputs can be
used to rebias capacitorcoupled differential or singleended input
signals.
The NB7V586M is offered in a low profile 5x5 mm 32pin PbFree
QFN package. Application notes, models, and support documentation
are available at www.onsemi.com.
The NB7V586M is a member of the GigaComm family of high
performance clock products.
Features
Maximum Input Data Rate > 10 Gb/s Typical
Data Dependent Jitter < 10 ps
Maximum Input Clock Frequency > 6 GHz Typical
Random Clock Jitter < 0.8 ps RMS, Max
Low Skew 1:6 CML Outputs, 20 ps Max
2:1 MultiLevel Mux Inputs
175 ps Typical Propagation Delay
50 ps Typical Rise and Fall Times
Differential CML Outputs, 330 mV PeaktoPeak, Typical
Operating Range: V
CC
= 1.71 V to 1.89 V
Operating Range: V
CCO
x = 1.14 V to 1.89 V
Internal 50 W Input Termination Resistors
V
REFAC
Reference Output
QFN32 Package, 5 mm x 5 mm
40°C to +85°C Ambient Operating Temperature
These are PbFree Devices
MARKING
DIAGRAM*
QFN32
MN SUFFIX
CASE 488AM
http://onsemi.com
*For additional marking information, refer to
Application Note AND8002/D.
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
ORDERING INFORMATION
SIMPLIFIED LOGIC DIAGRAM
32
1
NB7V
586M
AWLYYWW
G
1
A = Assembly Location
WL = Wafer Lot
YY = Year
WW = Work Week
G or G = PbFree Package
Q0
Q0
Q1
Q1
Q2
Q2
Q3
Q3
Q4
Q4
Q5
Q5
V
CCO1
V
CCO2
V
CCO3
V
CC
SEL
V
REFAC0
IN0
VT0
IN0
IN1
VT1
IN1
V
REFAC1
V
CC
GND
0
1
NB7V586M
http://onsemi.com
2
GND
2526272829303132
1514131211109
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
16
IN1
IN1
IN0
GND
VCC02
Q3
Q3
Q2
Q2
GND
VCC02
VREFAC0
IN0
VT1
VREFAC1
VT0
Figure 1. 32Lead QFN Pinout (Top View)
NB7V586M
Exposed Pad
(EP)
NC
VCC03
Q5
Q5
Q4
Q4
VCC03
GND
SEL
VCC
Q0
Q0
Q1
Q1
VCC01
Table 1. INPUT SELECT FUNCTION TABLE
SEL* CLK Input Selected
0 IN0
1 IN1
*Defaults HIGH when left open.
Table 2. PIN DESCRIPTION
Pin Name I/O Description
1,4
5,8
IN0, IN0
IN1, IN1
LVPECL, CML,
LVDS Input
Noninverted, Inverted, Differential Inputs
2,6 VT0, VT1 Internal 100 Ω Centertapped Termination Pin for IN0/IN0 and IN1/IN1
31 SEL LVTTL/LVCMOS
Input
Input Select pin; LOW for IN0 Inputs, HIGH for IN1 Inputs; defaults HIGH when left open
10 NC No Connect
30 VCC 1.8 V Positive Supply Voltage for the Inputs and Core Logic.
25 VCCO1 1.2 V or 1.8 V Positive Supply Voltage for the Q0, Q0, Q1, Q1 CML Outputs
18, 23 VCCO2 1.2 V or 1.8 V Positive Supply Voltage for the Q2, Q2, Q3, Q3 CML Outputs
11, 16 VCCO3 1.2 V or 1.8 V Positive Supply Voltage for the Q4, Q4, Q5, Q5 CML Outputs
29, 28
27, 26
Q0, Q0
Q1, Q1
1.2 V or 1.8 V
CML Output
Noninverted, Inverted Differential Outputs; powered by VCCO1 (Notes 1 and 2).
22, 21
20, 19
Q2, Q2
Q3, Q3
1.2 V or 1.8 V
CML Output
Noninverted, Inverted Differential Outputs; powered by VCCO2 (Notes 1 and 2).
15, 14
13, 12
Q4, Q4
Q5, Q5
1.2 V or 1.8 V
CML Output
Noninverted, Inverted Differential Outputs; powered by VCCO3 (Notes 1 and 2).
9, 17,
24, 32
GND Negative Supply Voltage, connected to Ground
3
7
VREFAC0
VREFAC1
Output Voltage Reference for CapacitorCoupled Inputs, only
EP The Exposed Pad (EP) on the QFN32 package bottom is thermally connected to the
die for improved heat transfer out of package. The exposed pad must be attached to a
heatsinking conduit. The pad is electrically connected to the die, and must be electric-
ally and thermally connected to GND on the PC board.
1. In the differential configuration when the input termination pins (VT0, VT1) are connected to a common termination voltage or left open, and
if no signal is applied on INn/INn
input, then, the device will be susceptible to selfoscillation. Qn/Qn outputs have internal 50 W source
termination resistors.
2. All V
CC
, VCC0x and GND pins must be externally connected to a power supply for proper operation.
NB7V586M
http://onsemi.com
3
Table 3. ATTRIBUTES
Characteristics Value
ESD Protection Human Body Model
Machine Model
> 2 kV
> 200 V
Input Pullup Resistor (R
PU
)
75 kW
Moisture Sensitivity (Note 3) Level 1
Flammability Rating Oxygen Index: 28 to 34 UL 94 V0 @ 0.125 in
Transistor Count 308
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
3. For additional information, see Application Note AND8003/D.
Table 4. MAXIMUM RATINGS
Symbol Parameter Condition 1 Condition 2 Rating Unit
V
CC
Positive Power Supply GND = 0 V 3.0 V
V
CCOx
Positive Power Supply GND = 0 V 3.0 V
V
IO
Input/Output Voltage GND = 0 V 0.5 v V
IO
v V
CC
+ 0.5 0.5 to V
CC
+ 0.5 V
V
INPP
Differential Input Voltage |IN
x
IN
x
| 1.89 V
I
IN
Input Current Through R
T
(50 Resistor)
$40 mA
I
OUT
Output Current Continuous
Surge
34
40
mA
I
VFREFAC
V
REFAC
Sink/Source Current $1.5 mA
T
A
Operating Temperature Range 40 to +85 °C
T
stg
Storage Temperature Range 65 to +150 °C
q
JA
Thermal Resistance (JunctiontoAmbient)
(Note 4)
0 lfpm
500 lfpm
QFN32
QFN32
31
27
°C/W
°C/W
q
JC
Thermal Resistance (JunctiontoCase)
(Note 4)
Standard Board QFN32 12 °C/W
T
sol
Wave Solder PbFree 265 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
4. JEDEC standard multilayer board 2S2P (2 signal, 2 power) with 8 filled thermal vias under exposed pad.

NB7V586MMNR4G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Drivers & Distribution TSMCFANOUT BFFR/XLTR
Lifecycle:
New from this manufacturer.
Delivery:
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