9
BM10 Series●0.4 mm Contact Pitch,Stacking Height 0.6mm 0.8mm Board-to-Board /Board-to-FPC Connectors
■Usage Recommendations
Manual soldering: 340±10ç for 3 seconds
H=0.8mm Header, Receptacle :Thickness 0.12mm
:Open area ratio 100%
* When using nitrogen-reflow, 75% only at the header side.
H=0.6mm Header Thickness 0.1mm
Receptacle 0.12mm:Open area ratio 100%
* When using nitrogen-reflow, 75% only at the header side.
Maximum of 0.02 mm at the connector center, with both ends of the
connector as reference points.
Refer to “Nylon Connector Use Handbook”.
■ Mating and un-mating of the connectors when not soldered on the
boards is not recommended as this may cause deformation of the
terminals, damage to the contacts or insulators.
■ Mated connectors should not carry weight of the board by
themselves. Provide some other support of the boards.
■ When mating/un-mating do not twist or lift by the corners. Apply the
forces evenly across the entire length and width of the connectors
taking care NOT to damage or deform soldered terminations.
■ Exercise extreme caution when mating/ un-mating when the
connector is mounted on a nonrigid (flexible) substrate.
Slight discoloration on the insulating materials will not affect form,
fit or function of the connectors.
■ Do NOT pull on the flexible substrate.
Note 1: Up to 2 cycles of Reflow soldering are possible under the
same conditions, provided that there is a return to normal
temperature between the first and second cycle.
Note 2: The temperature profile indicates the board surface
temperature at the point of contacts with the connector
terminals.
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1.Recommended temperature profile
2.Recommended manual soldering
3. Recommended screen thickness and open
area ratio (Pattern area ratio)
4.Board warpage
5.Cleaning conditions
6.Precautions
May.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
