MMBV409LT1

© Semiconductor Components Industries, LLC, 2006
January, 2006 − Rev. 3
1 Publication Order Number:
MMBV409LT1/D
MMBV409LT1
Preferred Device
Silicon Tuning Diode
This device is designed in the Surface Mount package for general
frequency control and tuning applications. It provides solid−state
reliability in replacement of mechanical tuning methods.
Features
High Q with Guaranteed Minimum Values at VHF Frequencies
Controlled and Uniform Tuning Ratio
Available in Surface Mount Package
Pb−Free Package is Available
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage V
R
20 Vdc
Forward Current I
F
200 mAdc
Forward Power Dissipation @ T
A
= 25°C
Derate above 25°C
P
D
225
1.8
mW
mW/°C
Junction Temperature T
J
+125 °C
Storage Temperature Range T
stg
55 to +150 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
http://onsemi.com
SOT−23 (TO−236)
CASE 318
STYLE 8
Device Package Shipping
ORDERING INFORMATION
MMBV409LT1 SOT−23 3,000 / Tape & Ree
l
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
MMBV409LT1G SOT−23
(Pb−Free)
3,000 / Tape & Ree
l
3
Cathode
1
Anode
Preferred devices are recommended choices for future use
and best overall value.
1
2
3
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
1
X5 M G
G
X5 = Specific Device Code
M = Date Code*
G = Pb−Free Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
MMBV409LT1
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (T
A
= 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
Reverse Breakdown Voltage
(I
R
= 10 mAdc)
V
(BR)R
20 Vdc
Reverse Voltage Leakage Current
(V
R
= 15 Vdc)
I
R
0.1
mAdc
Diode Capacitance Temperature Coefficient
(V
R
= 3.0 Vdc, f = 1.0 MHz)
TC
C
300 ppm/°C
C
t
, Diode Capacitance
V
R
= 3.0 Vdc, f = 1.0 MHz
pF
Q, Figure of Merit
V
R
= 3.0 Vdc
f = 50 MHz
C
R
, Capacitance Ratio
C
3
/C
8
f = 1.0 MHz (Note 1)
Device Min Nom Max Min Min Max
MMBV409LT1 26 29 32 200 1.5 1.9
1. C
R
is the ratio of C
t
measured at 3 Vdc divided by C
t
measured at 8 Vdc.
TYPICAL CHARACTERISTICS
Figure 1. Diode Capacitance
40
32
24
16
8
0
1 3 10 30 100
V
R
, REVERSE VOLTAGE (VOLTS)
Figure 2. Figure of Merit
f, FREQUENCY (MHz)
Figure 3. Leakage Current
T
A
, AMBIENT TEMPERATURE (°C)
Figure 4. Diode Capacitance
Q, FIGURE OF MERIT
10
1000
100
10
100 1000
, REVERSE CURRENT (nA)
100
−60
0.01
0.001
0 +40 +100
C
t
, DIODE CAPACITANCE (NORMALIZED)
1.04
−75
1.02
1.00
0.98
0.96
−25 +25 +75 +125
V
R
= 3.0 Vdc
f = 1.0 MHz
f = 1.0 MHz
T
A
= 25°C
V
R
= 3 Vdc
T
A
= 25°C
V
R
= 15 Vdc
+120 +140+80+60+20−40 −20
I
R
0.1
1.0
10
20
2.0
0.2
0.02
0.002
0.006
0.06
0.6
6.0
60
−50 0 +50 +100
1.03
1.01
0.99
0.97
C
T
, DIODE CAPACITANCE (pF)
T
A
, AMBIENT TEMPERATURE (°C)
220
MMBV409LT1
http://onsemi.com
3
PACKAGE DIMENSIONS
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
D
A1
3
12
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
STANDARD 318−08.
ǒ
mm
inches
Ǔ
SCALE 10:1
0.8
0.031
0.9
0.035
0.95
0.037
0.95
0.037
2.0
0.079
VIEW C
L
0.25
L1
q
e
E
E
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.001
b 0.37 0.44 0.50 0.015
c 0.09 0.13 0.18 0.003
D 2.80 2.90 3.04 0.110
E 1.20 1.30 1.40 0.047
e 1.78 1.90 2.04 0.070
L 0.10 0.20 0.30 0.004
0.040 0.044
0.002 0.004
0.018 0.020
0.005 0.007
0.114 0.120
0.051 0.055
0.075 0.081
0.008 0.012
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
H
E
0.35 0.54 0.69 0.014 0.021 0.029
c
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
MMBV409LT1/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.

MMBV409LT1

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Varactor Diodes 20V 26pF
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet