DM1AA-SF-PEJ(21)

C42
A(5:1) B(5:1) C(5:1)
(R0.6)
(R0.4)
(R0.6)
(R0.4)
(R0.6)
(R0.4)
1.7
+0.1
0
(Land)
1.2
+0.1
0
(Land)
1.3
+0.1
0
(Through hole)
0.8
+0.1
0
(Through hole)
1.9
+0.1
-0.1
(Land)
1.2
+0.1
0
(Land)
1.5
+0.1
0
(Through hole)
0.8
+0.1
0
(Through hole)
2.4
+0.1
-0.1
(Land)
1.2
+0.1
0
(Land)
2
+0.1
0
(Through hole)
0.8
+0.1
0
(Through hole)
CARD DETECT
COMMON FOR CD & WP
WP
A
A
C
B
5.62
9.47±0.05 12.8±0.05
11.2±0.05
9.75±0.05
0.8±0.05
1.4±0.05
8.05±0.05
12.5±0.05
5.625±0.05
P=2.5±0.05
1.25±0.05
8-1.1±0.05
12.57±0.05 11.23±0.05
14.13±0.05
11.93±0.05
2.03±0.05
1.4±0.05
23.48±0.05
26.98±0.05
28.5±0.05
14.25±0.05
0.8±0.05
11-2.5±0.051.05±0.05
28.25±0.05
3
3
Center of Card dimension
Reverse type
BPCB mounting pattern
2
(0.25)
(1.77)
No.8
No.7
No.6
No.5
No.4
No.3
No.2
No.1
No.9
28
(14.35)
18.68
2
16.85
6-0.65
1.5
1.85
1.050.35
2
2
2
2
2
27.2
2
27.45
29
2
8.63
1
C
L
1
C
L
2
6.95
2
7.65
5.62
2.9
1
C
L
1
C
L
29.9
SD Card
(5):Card pushed for insertion
(6):Card fully inserted
10:
Card ejected(Card ejected dimension)
Weight:2.1g
1
2
When card is ejected
OPEN OPEN CLOSE
WRITE PROTECT WRITE ENABLE
Card detection switch
When card
is ejected
When card
is ejected
When card
is ejected
Write protection switch
OPEN CLOSE
indicates the dimension of DIP terminals.
C
L
indicates the center line of the card slot.
Part No.
DM1B-DSF-PEJ(82) 609-0003-5 82
HRS No.
Nov.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.May.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
C43
2±0.15
4±0.1
1.75±0.1
Ø1.5
+0.1
0
36±0.1
3.4±0.3
4.35±0.3
44±0.3
40.4±0.1
20.2±0.1
Unreeling direction
BPackaging specifications
Embossed Carrier Tape Dimensions (Standard type) 450 pcs/reel
2±0.15
4±0.1
36±0.1
4.6±0.3
3.4±0.3
1.75±0.1
44±0.3
40.4±0.1
20.2±0.1
Ø1.5
+0.1
0
Unreeling direction
Embossed Carrier Tape Dimensions(Reverse type) 450 pcs/reel
End section
Blank section(160mm min.)
Mounting section(450) Lead section (400mm min.)
Blank section (100mm min.)
Embossed carrier tape
Top cover tape
(Ø380)
(Ø150)
D
Unreeling direction
44.4
+2
0
Reel dimensions
Nov.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.May.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
C44
BRecommended Temperature Profile
HRS test condition
Solder method : Reflow, IR/hot air
Environment : Room air
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
Test board : Glass epoxy 60mm∞100mm∞1.0mm thick
Metal mask : 0.15mm thick
Number of reflow cycles
: 2cycles max.
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
Temperature
50
90 to 120 seconds
Preheating
50
seconds
Soldering
Time (Seconds)
(ç)
100
150
200
250
150ç
200ç
230ç min.
Peak : 250ç MAX
Nov.1.2016 Copyright 2016 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Powered by TCPDF (www.tcpdf.org)
May.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Powered by TCPDF (www.tcpdf.org)

DM1AA-SF-PEJ(21)

Mfr. #:
Manufacturer:
Hirose Electric
Description:
Memory Connectors Memory Card Connectors SD MEM CD CONN R/A SMT PUSHPUSH
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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