C44
BRecommended Temperature Profile
HRS test condition
Solder method : Reflow, IR/hot air
Environment : Room air
Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu
(Senju Metal Industry, Co., Ltd.'s
Part Number:M705-GRN360-K2-V)
Test board : Glass epoxy 60mm∞100mm∞1.0mm thick
Metal mask : 0.15mm thick
Number of reflow cycles
: 2cycles max.
The temperature profiles shown are based on the above
conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume / thickness and board
size / thickness. Consult your solder paste and equipment
manufacturer for specific recommendations.
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May.1.2017 Copyright 2017 HIROSE ELECTRIC CO., LTD. All Rights Reserved.