NCV47701
http://onsemi.com
3
ABSOLUTE MAXIMUM RATINGS (Note 1)
Rating
Symbol Min Max Unit
Input Voltage V
in
−42 45 V
Enable Input Voltage V
EN
−42 45 V
Adjustable Input Voltage V
ADJ
−0.3 10 V
CSO Voltage V
CSO
−0.3 7 V
Output Voltage V
out
−1 40 V
Junction Temperature T
J
−40 150 °C
Storage Temperature T
STG
−55 150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
ESD CAPABILITY (Note 2)
Rating
Symbol Min Max Unit
ESD Capability, Human Body Model ESD
HBM
−2 2 kV
ESD Capability, Machine Model ESD
MM
−200 200 V
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
LEAD SOLDERING TEMPERATURE AND MSL (Note 3)
Rating Symbol Min Max Unit
Moisture Sensitivity Level SOIC−8 EP
SOIC−8
MSL 2
1
−
Lead Temperature Soldering, Reflow (SMD Styles Only), Pb−Free Versions T
SLD
− 265 peak °C
3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS (Note 4)
Rating
Symbol Value Unit
Thermal Characteristics, SOIC−8 EP (single layer PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
R
θJA
R
ψJL
70
19
°C/W
Thermal Characteristics, SOIC−8 EP (4 layers PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
R
θJA
R
ψJL
29
12
°C/W
Thermal Characteristics, SOIC−8 (single layer PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
R
θJA
R
ψJL
121
42
°C/W
Thermal Characteristics, SOIC−8 (4 layers PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
R
θJA
R
ψJL
77
52
°C/W
4. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm
2
(or 1 in
2
) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3,
4 layers − according to JEDEC51.7.