A) On Dual Value Resistors, (MCR), this is the res. ratio of the 2nd resistor
(Ratio Res.) To value of the 1st resistor (Prime Res.).
B) On Multi Tap Resistors (MMR). This is the tolerance of each of the small
value Resistor Taps. The large value Resistor Taps are called out on (4)
Single Value through Chip Resistor (Resistance top to bottom)
Single Value Pad to Pad Chip Resistor (Resistance Top pad to
Top pad)
Dual Value Center Tap Ratio Chip Resistor (Res. #1 = Prime
Value
/
Res. #2 = Ratio Value)
Please consult factory for special substrate materials (SP)
*R3A outline for resistances < 250 Ohms
Thin Film Resistor Chips
Resistor Ordering System
Example
1 2 3 4 5 6 7 8
MTR - 2R2K - SR2 - K - NA - G - 1 - T
4)
Is the resistor value total % + tolerance See chart below
5)
Is the 2nd resistor value total % ±tolerance (if applicable)
1)
Is the three letter device type designation
6) Backing
Gold Silicon eutectic attachment
2)
Is the resistance value in ohms
7)
The temperature coefficient (TCR) of the resistor, in PPM
8)
Resistor Material
Tantalum Nitride TaN (Self Passivating)
3) is the chip substrate material and
chip outline dimensions (case style) R1 thru R8
Example: part no. MTR-200RK-SR3-F-NA-G-0-T
This would be a silicon body .020” x .020” x .010” single value through chip
resistor with a total resistance tolerance of + 1%, a Solderable gold back, and
Tantalum Nitride as the resistor layer and a TCR of + 150PPM.
Example: part no. MCR-10RK-SR2-F-E-B-1-T
This would be a silicon body .030” x .030” x .010” two value ratio resistor with
the first value resistance tolerance of + 1%, and the second, ratio resistor, toler-
ance being + .1% of the first value. Resistance would be the total value of the
two resistor. A Bare lapped silicon back, and Tantalum Nitride as the resistor
layer and a TCR of + 100PPM.
Example: part no. MIR-2R5K-SR3-j-NA-B-2-N
This would be a silicon body .020” x .020” x .010” single value Top pad to Top
pad chip resistor with a total resistance tolerance of + 5%, a bare silicon back,
with NiChrome as the resistor layer and a TCR of + 50PPM.
Example: part no. MMR-11RK-SR1-F-K-G-1-T
This would be a silicon substrate device .038” x .038” x .010”. It would have a
total resistance of 11KOhms + 1%. It would have ten large tops of 1KOhm + 1%
each and ten small tops of 100 Ohms + 10% each. It would have a solderable
gold back with a TCR of + 100ppm and a Tantalum Nitride resistive layer.
