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MC74HC151ADTR2G

P1-P3P4-P6P7-P7
MC74HC151A
www.onsemi.com
4
SWITCHING WAVEFORMS
STROBE
Y
Figure 2. Figure 3.
Figure 4.
t
r
t
f
t
PHL
t
PLH
t
THL
t
TLH
STROBE
10%
50%
V
CC
GND
t
f
t
r
INPUT D
OUTPUT Y
10%
50%
90%
10%
50%
90%
t
TLH
t
PLH
t
PHL
t
THL
t
r
t
f
V
CC
GND
INPUT D
OUTPUT Y
t
PHL
t
PLH
t
THL
t
TLH
10%
50%
90%
10%
50%
90%
t
f
t
r
V
CC
GND
10%
50%
90%
t
PHL
t
PLH
10%
50%
90%
t
THL
t
TLH
V
CC
GND
V
CC
GND
50%
INPUT A
t
PLH
t
PHL
50%
OUTPUT
Y OR Y
10%
50%
90%
90%
Y
*Includes all probe and jig capacitance
C
L
*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
Figure 5.
Figure 6. Figure 7. Test Circuit
VALIDVALID
MC74HC151A
www.onsemi.com
5
Y
Y
5
6
D0
D1
D2
D3
D4
D5
D6
D7
A0
A1
A2
4
3
2
1
15
14
13
12
11
10
9
7
DATA
INPUTS
Figure 8. Expanded Logic Diagram
DATA
OUTPUTS
ADDRESS
INPUTS
STROBE
ORDERING INFORMATION
Device Package Shipping
†
MC74HC151ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC151ADR2G 2500 Tape & Reel
NLV74HC151ADR2G* 2500 Tape & Reel
MC74HC151ADTG
TSSOP−16
(Pb−Free)
96 Units / Tube
MC74HC151ADTR2G 2500 Tape & Reel
NLV74HC151ADTR2G* 2500 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP
Capable.
MC74HC151A
www.onsemi.com
6
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A 4.90 5.10 0.193 0.200
B 4.30 4.50 0.169 0.177
C −−− 1.20 −−− 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
G 0.65 BSC 0.026 BSC
H 0.18 0.28 0.007 0.011
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC 0.252 BSC
M 0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
SECTION N−N
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X L/2
−U−
S
U0.15 (0.006) T
S
U0.15 (0.006) T
S
U
M
0.10 (0.004) V
S
T
0.10 (0.004)
−T−
−V−
−W−
0.25 (0.010)
16X REFK
N
N
7.06
16X
0.36
16X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
P1-P3P4-P6P7-P7

MC74HC151ADTR2G

Mfr. #:
Buy MC74HC151ADTR2G
Manufacturer:
ON Semiconductor
Description:
Encoders, Decoders, Multiplexers & Demultiplexers IC MULTIPLEXER 8 CHANNEL
Lifecycle:
New from this manufacturer.
Delivery:
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