SIR844DP-T1-GE3

Vishay Siliconix
SiR844DP
New Product
Document Number: 64810
S09-0875-Rev. A, 18-May-09
www.vishay.com
1
N-Channel 25-V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
TrenchFET
®
Power MOSFET
New MOSFET Technology Optimized for
Ringing Reduction in Switching Applications
100 % R
g
Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Low-Side MOSFET
- Server, V
core
- DC/DC
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a
Q
g
(Typ.)
25
0.0028 at V
GS
= 10 V
50
a, g
29.5 nC
0.0038 at V
GS
= 4.5 V
50
a, g
Ordering Information: SiR844DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK
®
SO-8
Bottom View
N-Channel MOSFET
G
D
S
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/ppg?73257
). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed copper
(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under Steady State conditions is 70 °C/W.
g. Package limited.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
25
V
Gate-Source Voltage
V
GS
± 20
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
50
a, g
A
T
C
= 70 °C
50
g
T
A
= 25 °C
30
b, c
T
A
= 70 °C
24
b, c
Pulsed Drain Current
I
DM
70
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
50
g
T
A
= 25 °C
4.5
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
40
Single Pulse Avalanche Energy
E
AS
80
mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
50
W
T
C
= 70 °C
32
T
A
= 25 °C
5.0
b, c
T
A
= 70 °C
3.2
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)
d, e
260
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, f
t 10 s
R
thJA
20 25
°C/W
Maximum Junction-to-Case (Drain) Steady State
R
thJC
2.0 2.5
Vishay Siliconix
SiR844DP
www.vishay.com
2
Document Number: 64810
S09-0875-Rev. A, 18-May-09
New Product
Notes:
a. Pulse test; pulse width 300 µs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= 250 µA
25 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 µA
20
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
- 5.6
Gate-Source Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= 250 µA
1.0 2.6 V
Gate-Source Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 20 V
± 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= 25 V, V
GS
= 0 V
1
µA
V
DS
= 25 V, V
GS
= 0 V, T
J
= 55 °C
10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V
30 A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 15 A
0.0022 0.0028
Ω
V
GS
= 4.5 V, I
D
= 10 A
0.0030 0.0038
Forward Transconductance
a
g
fs
V
DS
= 10 V, I
D
= 15 A
50 S
Dynamic
b
Input Capacitance
C
iss
V
DS
= 10 V, V
GS
= 0 V, f = 1 MHz
3215
pFOutput Capacitance
C
oss
800
Reverse Transfer Capacitance
C
rss
475
Total Gate Charge
Q
g
V
DS
= 10 V, V
GS
= 10 V, I
D
= 10 A
60 90
nC
V
DS
= 10 V, V
GS
= 4.5 V, I
D
= 10 A
29.5 44
Gate-Source Charge
Q
gs
7.8
Gate-Drain Charge
Q
gd
9.7
Gate Resistance
R
g
f = 1 MHz 0.15 0.6 1.2 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 10 V, R
L
= 1 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
14 28
ns
Rise Time
t
r
918
Turn-Off Delay Time
t
d(off)
33 60
Fall Time
t
f
816
Tur n - O n D e l ay Time
t
d(on)
V
DD
= 10 V, R
L
= 1 Ω
I
D
10 A, V
GEN
= 4.5 V, R
g
= 1 Ω
30 55
Rise Time
t
r
21 40
Turn-Off Delay Time
t
d(off)
39 75
Fall Time
t
f
18 35
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
50
A
Pulse Diode Forward Current
a
I
SM
70
Body Diode Voltage
V
SD
I
S
= 3 A
0.73 1.1 V
Body Diode Reverse Recovery Time
t
rr
I
F
= 10 A, dI/dt = 100 A/µs, T
J
= 25 °C
25 50 ns
Body Diode Reverse Recovery Charge
Q
rr
15 30 nC
Reverse Recovery Fall Time
t
a
13
ns
Reverse Recovery Rise Time
t
b
12
Document Number: 64810
S09-0875-Rev. A, 18-May-09
www.vishay.com
3
Vishay Siliconix
SiR844DP
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
14
28
42
56
70
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
= 10 V thru 4 V
V
GS
=3V
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
0.0015
0.0020
0.0025
0.0030
0.0035
0.0040
0 12243648 60
V
GS
=10V
V
GS
=4.5V
0
2
4
6
8
10
01326395265
I
D
=10A
V
DS
=15V
V
DS
=10V
V
DS
=5V
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
2
4
6
8
10
012345
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
C
rss
0
840
1680
2520
3360
4200
0 5 10 15 20 25
C
iss
C
oss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.6
0.9
1.2
1.5
1.8
- 50 - 25 0 25 50 75 100 125 150
I
D
=15A
V
GS
=4.5V
V
GS
=10V
T
J
-Junction Temperature (°C)
(Normalized)
- On-ResistanceR
DS(on)

SIR844DP-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET RECOMMENDED ALT 78-SIRC10DP-T1-GE3
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet