MP2012 – 1.5A SYNCHRONOUS STEP-DOWN CONVERTER
MP2012 Rev. 1.01 www.MonolithicPower.com 2
9/22/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking Free Air Temperature (T
A
)
MP2012DQ QFN6(3x3mm) 9E
–40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP2012DQ–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP2012DQ–LF–Z)
PACKAGE REFERENCE
TOP VIEW
Exposed Pad
Connected to GND
FB
GND
SW
1
2
3
EN
VIN
PVIN
6
5
4
ABSOLUTE MAXIMUM RATINGS
(1)
PVIN, VIN to GND......................–0.3V to + 6.5V
SW to GND .......................... –0.3V to V
IN
+ 0.3V
EN, FB to GND ...........................–0.3V to +6.5V
Operating Temperature............. –40°C to +85°C
Continuous Power Dissipation (T
A
= +25°C)
(2)
………………………………………………....2.5W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature ............. –65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
.............................2.7V to 6V
Operating Junct. Temp (T
J
)..... –40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
QFN6 (3x3mm) .......................50 ...... 12 ... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX) = (T
J
(MAX)-T
A
)/
JA
. Exceeding the maximum allowable powe
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
