AD8044
REV. B
–5–
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +12.6 V
Internal Power Dissipation
2
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . 1.6 Watts
Small Outline Package (R) . . . . . . . . . . . . . . . . . . 1.0 Watts
Input Voltage (Common-Mode) . . . . . . . . . . . . . . ±V
S
± 0.5 V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ±3.4 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . .Observe Power Derating Curves
Storage Temperature Range (N, R) . . . . . . . –65∞C to +125∞C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300∞C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for the device in free air:
14-Lead Plastic Package: q
JA
= 75∞C/W
14-Lead SOIC Package: q
JA
= 120∞C/W
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8044 is limited by the associated rise in junction tempera-
ture. The maximum safe junction temperature for plastic encap-
sulated devices is determined by the glass transition temperature
of the plastic, approximately +150∞C. Exceeding this limit
temporarily may cause a shift in parametric performance due to
a change in the stresses exerted on the die by the package.
Exceeding a junction temperature of +175∞C for an extended
period can result in device failure.
While the AD8044 is internally short-circuit protected, this may
not be sufficient to guarantee that the maximum junction tem-
perature (+150∞C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the maximum
power derating curves.
AMBIENT TEMPERATURE (ⴗC)
2.5
2.0
0.5
–50 90–40
MAXIMUM POWER DISSIPATION (W)
–30 –20 –10 0 10 20 30 40 50 60 80
1.5
1.0
70
14-LEAD SOIC
14-LEAD PLASTIC DIP PACKAGE
T
J
= +150 C
Figure 3. Maximum Power Dissipation vs. Temperature
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD8016 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Temperature Package Package
Model Range Description Option
AD8044AN –40∞C to +85∞C 14-Lead PDIP N-14
AD8044AR-14 –40∞C to +85∞C 14-Lead SOIC R-14
AD8044AR-14-REEL –40∞C to +85∞C 14-Lead SOIC 13" REEL R-14
AD8044AR-14-REEL7 –40∞C to +85∞C 14-Lead SOIC 7" REEL R-14
AD8044ARZ-14* –40∞C to +85∞C 14-Lead Plastic SOIC R-14
AD8044ARZ-14-REEL* –40∞C to +85∞C 14-Lead SOIC 13" REEL R-14
AD8044ARZ-14-REEL7* –40∞C to +85∞C 14-Lead SOIC 7" REEL R-14
*Z = Pb free part
