DDR2 SDRAM Data Sheet Addendum
MT47H256M4 – 32 Meg x 4 x 8 banks
MT47H128M8 – 16 Meg x 8 x 8 banks
MT47H64M16 – 8 Meg x 16 x 8 banks
Features
This data sheet addendum provides information to
add the X option indicating the Product Longevity
Program for data sheet MT47H64M16NF-25E. This ad-
dendum does not provide detailed information about
the device. Refer to the general market data sheet for a
complete description of device functionality, operat-
ing modes, and specifications.
• V
DD
= 1.8V ±0.1V, V
DDQ
= 1.8V ±0.1V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 8 internal banks for concurrent operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
t
CK
• Selectable burst lengths (BL): 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Industrial temperature (IT) option
• Automotive temperature (AT) option
• RoHS-compliant
• Supports JEDEC clock jitter specification
Options
1
Marking
• Configuration
– 256 Meg x 4 (32 Meg x 4 x 8 banks) 256M4
– 128 Meg x 8 (16 Meg x 8 x 8 banks) 128M8
– 64 Meg x 16 (8 Meg x 16 x 8 banks) 64M16
• FBGA package (Pb-free) – x16
– 84-ball FBGA (8mm x 12.5mm) Die
Rev :H
HR
– 84-ball FBGA (8mm x 12.5mm) Die
Rev :M
NF
• FBGA package (Pb-free) – x4, x8
– 60-ball FBGA (8mm x 10mm) Die
Rev :H
CF
– 60-ball FBGA (8mm x 10mm) Die
Rev :M
SH
• FBGA package (lead solder) – x16
– 84-ball FBGA (8mm x 12.5mm) Die
Rev :H
HW
• FBGA package (lead solder) – x4, x8
– 60-ball FBGA (8mm x 10mm) Die
Rev :H
JN
• Timing – cycle time
– 1.875ns @ CL = 7 (DDR2-1066) -187E
– 2.5ns @ CL = 5 (DDR2-800) -25E
– 3.0ns @ CL = 5 (DDR2-667) -3
• Self refresh
– Standard None
– Low-power L
• Special options
– Product Longevity Program (PLP) X
• Operating temperature
– Commercial (0°C ≤ T
C
≤ +85°C)
2
None
– Industrial (–40°C ≤ T
C
≤ +95°C;
–40°C ≤ T
A
≤ +85°C)
IT
• Revision :H / :M
Notes:
1. Not all options listed can be combined to
define an offered product. Use the Part
Catalog Search on www.micron.com for
product offerings and availability.
2. For extended CT operating temperature see
the product data sheet.
1Gb: x4, x8, x16 DDR2 SDRAM Addendum
Features
PDF: 09005aef85a5c357
1gb_u68a_u88b_ddr2_addendum.pdf – Rev. A 9/14 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
