NL17SG126
http://onsemi.com
8
PACKAGE DIMENSIONS
SOT−953
CASE 527AE
ISSUE E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
D
C
A
H
E
123
45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM MIN NOM MAX
MILLIMETERS
A 0.34 0.37 0.40
b 0.10 0.15 0.20
C 0.07 0.12 0.17
D 0.95 1.00 1.05
E 0.75 0.80 0.85
e 0.35 BSC
L
0.95 1.00 1.05
H
E
X
Y
PIN ONE
INDICATOR
b
5X
X0.08 Y
L
5X
L3
L2
e
5X
5X
L2 0.05 0.10 0.15
L3 −−− −−− 0.15
0.175 REF
TOP VIEW
SIDE VIEW
BOTTOM VIEW
1.20
DIMENSIONS: MILLIMETERS
0.20
5X
1
PACKAGE
OUTLINE
0.35
PITCH
0.35
5X
