DATASHEET
BoardLevelCooling–3743
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING–37432
37432isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumber DeviceType
374324B00032G BGA,FPGA
374324B00035G BGA,FPGA
374324B60023G BGA,FPGA
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions:
374324B00032G
Tape
DeviceAttachmentOptions:
374324B00035G
Tape
DeviceAttachmentOptions
374324B60023G
‐
ThermalInterfaceMaterial:
374324B00032G
T405RChomericsTapeforMetal
Surfaces
ThermalInterfaceMaterial:
374324B00035G
T411ChomericsTapeforAllSurfaces
ThermalInterfaceMaterial:
374324B60023G
T766ChomericsPhaseChangeforAll
Surfaces
Property Details
HeatSinkWidth(mm) 27.00
HeatSinkLength(mm) 27.00
HeatSinkHeight(mm) 10.00
HeatSinkMountingDirection Horizontal,Vertical
PartNumbers:374324B00032G,374324B00035G