2004-2013 Microchip Technology Inc. DS21876B-page 13
MCP1650/51/52/53
4.0 DETAILED DESCRIPTION
4.1 Device Overview
The MCP1650/51/52/53 is a gated oscillator boost
controller. By adding an external N-channel MOSFET,
schottky diode and boost inductor, high-output power
applications can be achieved. The 750 kHz hysteretic
gated oscillator architecture enables the use of small,
low-cost external components. By using a hysteretic
approach, no compensation components are
necessary for the stability of the regulator output.
Output voltage regulation is accomplished by
comparing the output voltage (sensed through an
external resistor divider) to a reference internal to the
MCP1650/51/52/53. When the sensed output voltage
is below the reference, the EXT pin pulses the external
N-channel MOSFET on and off at the 750 kHz gated
oscillator frequency. Energy is stored in the boost
inductor when the external N-channel MOSFET is on
and is delivered to the load through the external
Schottky diode when the MOSFET is turned off.
Several pulses may be required to deliver enough
energy to pump the output voltage above the upper
hysteretic limit. Once above the hysteretic limit, the
internal oscillator is no longer gated to the EXT pin and
no energy is transferred from input to output.
The peak current in the MOSFET is sensed to limit its
maximum value. As with all boost topology converters,
even though the MOSFET is turned off, there is still a
DC path through the boost inductor and diode to the
load. Additional protection circuity, such as fuses, are
recommended for short circuit protection.
4.2 Input Voltage
The range of input voltage for the MCP1650/51/52/53
family of devices is specified from 2.7V to 5.5V. For the
S-option devices, the undervoltage lockout (UVLO)
feature will turn the boost controller off once the input
voltage falls below 2.55V, typical. For the R-option
devices, the UVLO is set to 2.0V. The R-option devices
are recommended for use when “bootstrapping” the
output voltage back to the input. The input of the
MCP1650/51/52/53 device is supplied by the output
voltage during boost operation. This can be used to
derive output voltages from input voltages that start up
at approximately 2V (2-cell alkaline batteries).
4.3 Fixed Duty Cycle
The MCP1650/51/52/53 family utilizes a unique two-
step maximum duty cycle architecture to minimize input
peak current and improve output ripple voltage for wide
input voltage operating ranges. When the input voltage
is below 3.8V, the duty cycle is typically 80%. For input
voltages above 3.8V, the duty cycle is typically 56%. By
decreasing the duty cycle at higher input voltages, the
input peak current is reduced. For low input voltages, a
longer duty cycle stores more energy during the on-
time of the boost MOSFET. For applications that span
the 3.8V input range, the inductor value should be
selected to meet not only the minimum input voltage at
80% duty cycle, but 3.8V at 56% duty cycle as well.
Refer to Section 5.0 “Application Circuits/Issues
for more information about selecting inductor values.
4.4 Shutdown Input Operation
The SHDN pin is used to turn the MCP1650/51/52/53
on and off. When the SHDN
pin is tied low, the
MCP1650/51/52/53 is off. When tied high, the
MCP1650/51/52/53 will be enabled and begin boost
operation as long as the input voltage is not below the
UVLO threshold.
4.5 Soft-Start Operation
When power is first applied to the MCP1650/51/52/53,
the internal reference initialization is controlled to slow
down the start-up of the boost output voltage.This is
done to reduce high inrush current required from the
source. High inrush currents can cause the source
voltage to drop suddenly and trip the UVLO threshold,
shutting down the converter prior to it reaching steady-
state operation.
4.6 Gated Oscillator Architecture
A 750 kHz internal oscillator is used as the base
frequency of the MCP1650/51/52/53. The oscillator
duty cycle is typically 80% when the input voltage is
below a nominal value of 3.8V, and 56% when the
input voltage is above a nominal value of 3.8V. Two
duty cycles are provided to reduce the peak inductor
current in applications where the input voltage varies
over a wide range. High-peak inductor current results
in undesirable high-output ripple voltages. For
applications that have input voltage that cross this
3.8V boundary, both duty cycle conditions need to be
examined to determine which one has the least
amount of energy storage. Refer to Section 5.0
“Application Circuits/Issues” for more information
about design considerations.
MCP1650/51/52/53
DS21876B-page 14 2004-2013 Microchip Technology Inc.
4.7 FB Pin
The output voltage is fed back through a resistor divider
to the FB pin. It is then compared to an internal 1.22V
reference. When the divided-down output is below the
internal reference, the internal oscillator is gated on
and the EXT pin pulses the external N-channel
MOSFET on and off to transfer energy from the source
to the load at 750 kHz. This will cause the output volt-
age to rise until it is above the 1.22V threshold, thereby
gating the internal oscillator off. Hysteresis is provided
within the comparator and is typically 12 mV. The rate
at which the oscillator is gated on and off is determined
by the input voltage, load current, hysteresis voltage
and inductance. The output ripple voltage will vary
depending on the input voltage, load current,
hysteresis voltage and inductance.
4.8 PWM Latch
The gated oscillator is self-latched to prevent double
and sporadic pulsing. The reset into the latch is asyn-
chronous and can terminate the pulse during the on-
time of the duty cycle. The reset can be accomplished
by the feedback voltage comparator or the current limit
comparator.
4.9 Peak Inductor Current
The external switch peak current is sensed on the CS
pin across an optional external current sense resistor.
If the CS pin falls more than 122 mV (typical) below
V
IN
, the current limit comparator is set and the pulse is
terminated. This prevents the current from getting too
high and damaging the N-channel MOSFET. In the
event of a short circuit, the switch current will be low
due to the current limit. However, there is a DC path
from the input through the inductor and external diode.
This is true for all boost-derived topologies and addi-
tional protection circuitry is necessary to prevent
catastrophic damage.
4.10 EXT Output Driver
The EXT output pin is designed to directly drive
external N-channel MOSFETs and is capable of
sourcing 400 mA (typical) and sinking 800 mA (typical)
for fast on and off transitions. The top side of the EXT
driver is connected directly to V
IN
, while the low side of
the driver is tied to GND, providing rail-to-rail drive
capability. Design flexibility is added by connecting an
external resistor in series with the N-channel MOSFET
to control the speed of the turn on and off. By slowing
the transition speed down, there will be less high-
frequency noise. Speeding the transition up produces
higher efficiency.
4.11 Low Battery Detect
The Low-Battery Detect (MCP1651 and MCP1653
only) feature can be used to determine when the LBI
input voltage has fallen below a predetermined
threshold. The low-battery detect comparator
continuously monitors the voltage on the LBI pin. When
the voltage on the LBI pin is above the 1.22V + 123 mV
hysteresis, the LBO
pin will be high-impedance (open-
drain). When in the high-impedance state, the leakage
current into the LBO
pin is typically less than 0.1 µA. As
the voltage on the LBI pin decreases and is lower than
the 1.22V typical threshold, the LBO pin will transition
to a low state and is capable of sinking up to 10 mA.
123 mV of hysteresis is provided to prevent chattering
of the LBO
pin as a result of battery input impedance
and boost input current.
4.12 Power Good Output
The Power Good Output feature (MCP1652 and
MCP1653 only) monitors the divided-down voltage
feedback into the FB pin. When the output voltage falls
more than 15% (typical) below the regulated set point,
the power good (PG) output pin will transition from a
high-impedance state (open-drain) to a low state
capable of sinking 10 mA. If the output voltage rises
more than 15% (typical) above the regulated set point,
the PG output pin will transition from high to low.
4.13 Device Protection
4.13.1 OVERCURRENT LIMIT
The Current Sense (CS) input pin is used to sense the
peak input current of the boost converter. This can be
used to limit how high the peak inductor current can
reach. The current sense feature is optional and can be
bypassed by connecting the V
IN
input pin to the CS
input pin. Because of the path from input through the
boost inductor and boost diode to output, the boost
topology cannot support a short circuit without
additional circuitry. This is typical of all boost regulators.
2004-2013 Microchip Technology Inc. DS21876B-page 15
MCP1650/51/52/53
5.0 APPLICATION CIRCUITS/
ISSUES
5.1 Typical Applications
The MCP1650/51/52/53 boost controller can be used in
several different configurations and in many different
applications. For applications that require minimum
space, low cost and high efficiency, the MCP1650/51/
52/53 product family is a good choice. It can be used in
boost, buck-boost, Single-Ended Primary Inductive
Converters (SEPIC), as well as in flyback converter
topologies.
5.1.1 NON-BOOTSTRAP BOOST
APPLICATIONS
Non-bootstrap applications are typically used when the
output voltage is boosted to a voltage that is higher
than the rated voltage of the MCP1650/51/52/53. For
non-bootstrap applications, the input voltage is
connected to the boost inductor through the optional
current sense resistor and the V
IN
pin of the MCP1650/
51/52/53. For this type of application, the S-option
devices (UVLO at 2.55V, typical) should be used. The
gated oscillator duty cycle will be dependant on the
value of the voltage on V
IN
. If V
IN
> 3.8V, the duty cycle
will be 56%. If V
IN
< 3.8V, the duty cycle will be 80%.
In non-bootstrap applications, output voltages of over
100V can be generated. Even though the MCP1650/
51/52/53 device is not connected to the high boost
output voltage, the drain of the external MOSFET and
reverse voltage of the external Schottky diode are
connected. The output voltage capacitor must also be
rated for the output voltage.
FIGURE 5-1: Typical Non-Bootstrap Application Circuit (MCP1650/51/52/53).
FB
CS
SHDN
V
IN
8
2
5
6
4
7
MCP1650
GND
Input
Voltage
3.3V ±10%
C
IN
10 µF
off
on
EXT
Boost
Inductor
3.3 µH
C
OUT
10 µF
Ceramic
90.9 k
V
OUT
= 12V
I
OUT
= 0 to 100 mA
10 k
MOSFET/Schottky
Combination Device
R
SENSE
0.05
3.3V to 12V 100 mA Boost Converter
1
3
NC
NC

MCP1650ST-E/MS

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Switching Controllers UVLO 2.55V
Lifecycle:
New from this manufacturer.
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