IRL1004PBF

IRL1004PbF
HEXFET
®
Power MOSFET
PD - 95403
S
D
G
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 0.75
R
θCS
Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/W
R
qJA
Junction-to-Ambient ––– 62
Thermal Resistance
V
DSS
= 40V
R
DS(on)
= 0.0065
I
D
= 130A
l Logic-Level Gate Drive
l Advanced Process Technology
l Ultra Low On-Resistance
l Dynamic dv/dt Rating
l 175°C Operating Temperature
l Fast Switching
l Fully Avalanche Rated
Fifth Generation HEXFET
®
power MOSFETs from
International Rectifier utilize advanced processing techniques
to achieve the lowest possible on-resistance per silicon
area. This benefit, combined with the fast switching speed
and ruggedized device design that HEXFET power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power dissipation levels
to approximately 50 watts. The low thermal resistance and
low package cost of the TO-220 contribute to its wide
acceptance throughout the industry.
Description
6/17/04
Parameter Max. Units
I
D
@ T
C
= 25°C Continuous Drain Current, V
GS
@ 10V 130
I
D
@ T
C
= 100°C Continuous Drain Current, V
GS
@ 10V 92 A
I
DM
Pulsed Drain Current 520
P
D
@T
C
= 25°C Power Dissipation 200 W
Linear Derating Factor 1.3 W/°C
V
GS
Gate-to-Source Voltage ± 16 V
E
AS
Single Pulse Avalanche Energy 700 mJ
I
AR
Avalanche Current 78 A
E
AR
Repetitive Avalanche Energy 20 mJ
dv/dt Peak Diode Recovery dv/dt 5.0 V/ns
T
J
Operating Junction and -55 to + 175
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (1.6mm from case)
°C
Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)
Absolute Maximum Ratings
www.irf.com 1
TO-220AB
l Lead-Free
IRL1004PbF
2 www.irf.com
Parameter Min. Typ. Max. Units Conditions
V
(BR)DSS
Drain-to-Source Breakdown Voltage 40 –– –– V V
GS
= 0V, I
D
= 250µA
V
(BR)DSS
/T
J
Breakdown Voltage Temp. Coefficient ––– 0.04 –– V/°C Reference to 25°C, I
D
= 1mA
–– –– 0.0065 V
GS
= 10V, I
D
= 78A
––– ––– 0.009 V
GS
= 4.5V, I
D
= 65A
V
GS(th)
Gate Threshold Voltage 1.0 ––– ––– V V
DS
= V
GS
, I
D
= 250µA
g
fs
Forward Transconductance 63 ––– ––– S V
DS
= 25V, I
D
= 78A
––– ––– 25 V
DS
= 40V, V
GS
= 0V
––– ––– 250 V
DS
= 32V, V
GS
= 0V, T
J
= 150°C
Gate-to-Source Forward Leakage ––– ––– 100
nA
V
GS
= 16V
Gate-to-Source Reverse Leakage ––– ––– -100 V
GS
= -16V
Q
g
Total Gate Charge –– –– 100 I
D
= 78A
Q
gs
Gate-to-Source Charge ––– ––– 32 nC V
DS
= 32V
Q
gd
Gate-to-Drain ("Miller") Charge ––– ––– 43 V
GS
= 4.5V, See Fig. 6 and 13
t
d(on)
Turn-On Delay Time ––– 16 –– V
DD
= 20V
t
r
Rise Time ––– 210 –– I
D
= 78A
t
d(off)
Turn-Off Delay Time ––– 25 –– R
G
= 2.5, V
GS
= 4.5V
t
f
Fall Time ––– 14 –– R
D
= 0.18, See Fig. 10
Between lead,
6mm (0.25in.)
from package
and center of die contact
C
iss
Input Capacitance ––– 5330 ––– V
GS
= 0V
C
oss
Output Capacitance ––– 1480 ––– pF V
DS
= 25V
C
rss
Reverse Transfer Capacitance ––– 320 –– ƒ = 1.0MHz, See Fig. 5
Electrical Characteristics @ T
J
= 25°C (unless otherwise specified)
I
GSS
I
DSS
Drain-to-Source Leakage Current
L
D
Internal Drain Inductance ––– 4.5 –––
L
S
Internal Source Inductance ––– 7.5 –––
R
DS(on)
Static Drain-to-Source On-Resistance
µA
ns
S
D
G
Source-Drain Ratings and Characteristics
Repetitive rating; pulse width limited by
max. junction temperature. (See fig. 11)
I
SD
78A, di/dt 370A/µs, V
DD
V
(BR)DSS
,
T
J
175°C
Notes:
Starting T
J
= 25°C, L =0.23mH
R
G
= 25, I
AS
= 78A. (See Figure 12)
Pulse width 300µs; duty cycle 2%
Calculated continuous current based on maximum allowable
junction temperature; for recommended current-handling of the
package refer to Design Tip #93-4
Parameter Min. Typ. Max. Units Conditions
I
S
Continuous Source Current MOSFET symbol
(Body Diode)
––– –––
showing the
I
SM
Pulsed Source Current integral reverse
(Body Diode)
––– –––
p-n junction diode.
V
SD
Diode Forward Voltage ––– ––– 1.3 V T
J
= 25°C, I
S
= 78A, V
GS
= 0V
t
rr
Reverse Recovery Time ––– 78 120 ns T
J
= 25°C, I
F
= 78A
Q
rr
Reverse Recovery Charge ––– 180 270 nC di/dt = 100A/µs
t
on
Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by L
S
+L
D
)
S
D
G
130
520
A
nH
IRL1004PbF
www.irf.com 3
Fig 1. Typical Output Characteristics
Fig 3. Typical Transfer Characteristics
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 2. Typical Output Characteristics
-60 -40 -20 0 20 40 60 80 100 120 140 160 180
0.0
0.5
1.0
1.5
2.0
2.5
T , Junction Temperature ( C)
R , Drain-to-Source On Resistance
(Normalized)
J
DS(on)
°
V =
I =
GS
D
10V
130A
0.1
1
10
100
1000
10000
0.1 1 10 100
20µs PULSE WIDTH
T = 25 C
J
°
TOP
BOTTOM
VGS
15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
2.7V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
2.7V
1
10
100
1000
0.1 1 10 100
20µs PULSE WIDTH
T = 175 C
J
°
TOP
BOTTOM
VGS
15V
10V
7.0V
5.5V
4.5V
4.0V
3.5V
2.7V
V , Drain-to-Source Voltage (V)
I , Drain-to-Source Current (A)
DS
D
2.7V
0.1
1
10
100
1000
2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0
V = 50V
20µs PULSE WIDTH
DS
V , Gate-to-Source Voltage (V)
I , Drain-to-Source Current (A)
GS
D
T = 25 C
J
°
T = 175 C
J
°
25

IRL1004PBF

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
MOSFET MOSFT 130A 66.7nC 6.5mOhm LogLvAB
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet