© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 11
1 Publication Order Number:
1SMB5.0AT3/D
1SMB5.0AT3 Series
600 Watt Peak Power Zener
Transient Voltage
Suppressors
Unidirectional*
The SMB series is designed to protect voltage sensitive
components from high voltage, high energy transients. They have
excellent clamping capability, high surge capability, low zener
impedance and fast response time. The SMB series is supplied in
ON Semiconductor’s exclusive, cost-effective, highly reliable
Surmetict package and is ideally suited for use in communication
systems, automotive, numerical controls, process controls, medical
equipment, business machines, power supplies and many other
industrial/consumer applications.
Features
• Working Peak Reverse Voltage Range − 5.0 V to 170 V
• Standard Zener Breakdown Voltage Range − 6.7 V to 199 V
• Peak Power − 600 W @ 1.0 ms
• ESD Rating of Class 3 (>16 kV) per Human Body Model
• Maximum Clamp Voltage @ Peak Pulse Current
• Low Leakage < 5.0 mA Above 10 V
• UL 497B for Isolated Loop Circuit Protection
• Response Time is Typically < 1.0 ns
• Pb−Free Packages are Available
Mechanical Characteristics
CASE:
Void-free, transfer-molded, thermosetting plastic
FINISH: All external surfaces are corrosion resistant and leads are
readily solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
LEADS: Modified L−Bend providing more contact area to bond pads
POLARITY: Cathode indicated by polarity band
MOUNTING POSITION: Any
PLASTIC SURFACE MOUNT
ZENER OVERVOLTAGE
TRANSIENT SUPPRESSORS
5.0 V − 170 V,
600 W PEAK POWER
Device Package Shipping
†
ORDERING INFORMATION
1SMBxxxAT3 SMB 2500/Tape & Reel
SMB
CASE 403A
PLASTIC
Cathode Anode
http://onsemi.com
1SMBxxxAT3G SMB
(Pb−Free)
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
DEVICE MARKING INFORMATION
A = Assembly Location
Y = Year
WW = Work Week
xx = Device Code (Refer to page 3)
G = Pb−Free Package
MARKING DIAGRAM
AYWW
xx G
G
(Note: Microdot may be in either location)