SI9933CDY-T1-GE3

Vishay Siliconix
Si9933CDY
New Product
Document Number: 68791
S-81729-Rev. A, 04-Aug-08
www.vishay.com
1
Dual P-Channel 20-V (D-S) MOSFET
FEATURES
Halogen-free Option Available
•TrenchFET
®
Power MOSFET
100 % R
g
and UIS Tested
APPLICATIONS
Load Switch
DC/DC Converter
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)
I
D
(A)
a, e
Q
g
(Typ.)
- 20
0.058 at V
GS
= - 4.5 V - 4
8
0.094 at V
GS
= - 2.5 V - 4
Notes:
a. Based on T
C
= 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 110 °C/W.
e. Package Limited.
ABSOLUTE MAXIMUM RATINGS T
A
= 25 °C, unless otherwise noted
Parameter Symbol Limit Unit
Drain-Source Voltage
V
DS
- 20
V
Gate-Source Voltage
V
GS
± 12
Continuous Drain Current (T
J
= 150 °C)
T
C
= 25 °C
I
D
- 4
e
A
T
C
= 70 °C - 4
e
T
A
= 25 °C
- 4
b, c, e
T
A
= 70 °C
- 3.8
b, c
Pulsed Drain Current (10 µs Pulse Width)
I
DM
- 20
Source-Drain Current Diode Current
T
C
= 25 °C
I
S
- 2.5
T
A
= 25 °C
- 1.7
b, c
Single Pulse Avalanche Current
L = 0.1 mH
I
AS
- 6
Single-Pulse Avalanche Energy
E
AS
1.8 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
3.1
W
T
C
= 70 °C 2
T
A
= 25 °C
2
b, c
T
A
= 70 °C
1.28
b, c
Operating Junction and Storage Temperature Range
T
J
, T
stg
- 50 to 150 °C
S
1
G
1
D
1
P-Channel MOSFET
S
2
G
2
D
2
P-Channel MOSFET
S
1
D
1
G
1
D
1
S
2
D
2
G
2
D
2
SO-8
5
6
7
8
Top View
2
3
4
1
Ordering Information: Si9933CDY-T1-E3 (Lead (Pb)-free)
Si9933CDY-T1-GE3 (Lead (Pb)-free and Halogen-free)
THERMAL RESISTANCE RATINGS
Limit
Parameter Symbol Typical Maximum Unit
Maximum Junction-to-Ambient
b, d
t 10 s
R
thJA
52 62.5
°C/W
Maximum Junction-to-Foot (Drain)
Steady State
R
thJF
32 40
RoHS
COMPLIANT
www.vishay.com
2
Document Number: 68791
S-81729-Rev. A, 04-Aug-08
Vishay Siliconix
Si9933CDY
New Product
Notes:
a. Guaranteed by design, not subject to production testing.
b. Pulse test; pulse width 300 µs, duty cycle 2 %.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS T
J
= 25 °C, unless otherwise noted
Parameter Symbol Test Conditions Min. Typ.
a
Max. Unit
Static
Drain-Source Breakdown Voltage
V
DS
V
GS
= 0 V, I
D
= - 250 µA
- 20 V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= - 250 µA
- 19
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
3.1
Gate Threshold Voltage
V
GS(th)
V
DS
= V
GS
, I
D
= - 250 µA
- 0.6 - 1.4 V
Gate-Body Leakage
I
GSS
V
DS
= 0 V, V
GS
= ± 12 V
- 100 nA
Zero Gate Voltage Drain Current
I
DSS
V
DS
= - 20 V, V
GS
= 0 V
- 1
µA
V
DS
= - 20 V, V
GS
= 0 V, T
J
= 55 °C
- 10
On-State Drain Current
b
I
D(on)
V
DS
= - 5 V, V
GS
= - 10 V - 20 A
Drain-Source On-State Resistance
b
R
DS(on)
V
GS
= - 4.5 V, I
D
= - 4.8 A
0.048 0.058
Ω
V
GS
= - 2.5 V, I
D
= - 1 A
0.075 0.094
Forward Transconductance
b
g
fs
V
DS
= - 10 V, I
D
= - 4.8 A
11 S
Dynamic
a
Input Capacitance
C
iss
V
DS
= - 10 V, V
GS
= 0 V, f = 1 MHz
665
pFOutput Capacitance
C
oss
140
Reverse Transfer Capacitance
C
rss
115
Total Gate Charge
Q
g
V
DS
= - 10 V, V
GS
= - 10 V, I
D
= - 4.8 A
17 26
nC
V
DS
= - 10 V, V
GS
= - 4.5 V, I
D
= - 4.8 A
812
Gate-Source Charge
Q
gs
2
Gate-Drain Charge
Q
gd
3
Gate Resistance
R
g
f = 1 MHz 1.2 6 12 Ω
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 2.6 Ω
I
D
- 3.8 A, V
GEN
= - 10 V, R
g
= 1 Ω
612
ns
Rise Time
t
r
15 23
Turn-Off Delay Time
t
d(off)
26 39
Fall Time
t
f
918
Tur n - O n D e l ay Time
t
d(on)
V
DD
= - 10 V, R
L
= 2.6 Ω
I
D
- 3.8 A, V
GEN
= - 4.5 V, R
g
= 1 Ω
21 32
Rise Time
t
r
50 75
Turn-Off Delay Time
t
d(off)
29 44
Fall Time
t
f
13 20
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
I
S
T
C
= 25 °C
- 2.5
A
Pulse Diode Forward Current
a
I
SM
- 20
Body Diode Voltage
V
SD
I
S
= - 3.8 A
- 0.77 - 1.2 V
Body Diode Reverse Recovery Time
t
rr
I
F
= - 3.8 A, dI/dt = 100 A/µs, T
J
= 25 °C
30 45 ns
Body Diode Reverse Recovery Charge
Q
rr
17 26 nC
Reverse Recovery Fall Time
t
a
16
ns
Reverse Recovery Rise Time
t
b
14
Document Number: 68791
S-81729-Rev. A, 04-Aug-08
www.vishay.com
3
Vishay Siliconix
Si9933CDY
New Product
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Output Characteristics
On-Resistance vs. Drain Current and Gate Voltage
Gate Charge
0
4
8
12
16
20
012345
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)I
D
V
GS
=5thru 3.5 V
V
GS
=1.5V
V
GS
=2V
V
GS
=2.5V
V
GS
=3V
0.00
0.04
0.08
0.12
0.16
0 5 10 15 20
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
=4.5V
V
GS
=2.5V
0
2
4
6
8
10
0 3 6 9 121518
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=16V
V
DS
=10V
I
D
=4.8 A
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0.0 0.5 1.0 1.5 2.0 2.5
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
= 25 °C
T
C
= 125 °C
T
C
= - 55 °C
0
300
600
900
1200
04
8 12 16 20
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
C
oss
C
rss
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
- 50 - 25 0 25 50 75 100 125 150
T
J
-Junction Temperature (°C)
(Normalized)
- On-Resistance
R
DS(on)
V
GS
= - 4.5 V;I
D
= - 4.8 A
V
GS
= - 2.5 V;I
D
= - 3.8 A
I
D
=20A

SI9933CDY-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET -20V Vds 12V Vgs SO-8
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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