MT18HTF12872FDZ-667G1N8

Table 7: I
DD
Conditions (Continued)
Symbol Condition
I
DD_TRAINING
Training: Primary and secondary channels enabled; 100% toggle on all channel lanes;
DRAMs idle; 0% bandwidth; CKE HIGH; Command and address lines stable; DDR2 SDRAM
clock active
I
DD_IBIST
IBIST over all IBIST modes: DRAM idle (0% bandwidth); Primary channel enabled; Secon-
dary channel enabled; CKE HIGH; Command and address lines stable; DDR2 SDRAM clock active
I
DD_EI
Electrical idle: DRAM idle (0% bandwidth); Primary channel disabled; Secondary channel
disabled; CKE LOW; Command and address lines floated; DDR2 SDRAM clock active; ODT and
CKE driven LOW
Note:
1. Actual test conditions may vary from published JEDEC test conditions.
Table 8: I
DD
Specifications – 1GB DDR2-667
Symbol I
DD_IDLE_0
I
DD_IDLE_1
I
DD_ACTIVE_1
I
DD_ACTIVE_2
I
DD_TRAINING
I
DD_IBIST
I
DD_EI
Units
I
CC
2600 3400 3900 3700 4000 4500 2500 A
I
DD
1510 1510 2777 1510 1510 1510 326 A
Total power 7.0 8.2 11.4 8.7 9.2 10.0 4.6 W
Table 9: I
DD
Specifications – 1GB DDR2-800
Symbol I
DD_IDLE_0
I
DD_IDLE_1
I
DD_ACTIVE_1
I
DD_ACTIVE_2
I
DD_TRAINING
I
DD_IBIST
I
DD_EI
Units
I
CC
TBD TBD TBD TBD TBD TBD TBD A
I
DD
TBD TBD TBD TBD TBD TBD TBD A
Total power TBD TBD TBD TBD TBD TBD TBD W
Table 10: I
DD
Specifications – 2GB DDR2-667
Symbol I
DD_IDLE_0
I
DD_IDLE_1
I
DD_ACTIVE_1
I
DD_ACTIVE_2
I
DD_TRAINING
I
DD_IBIST
I
DD_EI
Units
I
CC
2600 3400 3900 3700 4000 4500 2500 A
I
DD
1420 1420 2515 1420 1420 1420 326 A
Total power 6.8 8.1 11.0 8.5 9.0 9.8 4.6 W
Table 11: I
DD
Specifications – 2GB DDR2-800
Symbol I
DD_IDLE_0
I
DD_IDLE_1
I
DD_ACTIVE_1
I
DD_ACTIVE_2
I
DD_TRAINING
I
DD_IBIST
I
DD_EI
Units
I
CC
TBD TBD TBD TBD TBD TBD TBD A
I
DD
TBD TBD TBD TBD TBD TBD TBD A
Total power TBD TBD TBD TBD TBD TBD TBD W
Note:
1. Total power is based on maximum voltage levels, I
CC
at 1.575V and I
DD
at 1.9V.
Serial Presence-Detect EEPROM
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Serial Presence-Detect EEPROM
PDF: 09005aef83d4d75e
htf18c128_256x72fdz.pdf - Rev. B 07/10 EN
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
Table 12: Serial Presence-Detect EEPROM DC Operating Conditions
Parameter/Condition Symbol Min Max Units
EEPROM and AMB supply voltage V
DDSPD
3 3.6 V
Input high voltage: Logic 1; all inputs V
IH
V
DDSPD
× 0.7 V
DDSPD
+ 0.5 V
Input low voltage: Logic 0; all inputs V
IL
–0.6 V
DDSPD
× 0.3 V
Output low voltage: I
OUT
= 3mA V
OL
0.4 V
Input leakage current: V
IN
= GND to V
DD
I
LI
0.10 3 µA
Output leakage current: V
OUT
= GND to V
DD
I
LO
0.05 3 µA
Standby current I
SB
1.6 4 µA
Power supply current, READ: SCL clock frequency = 100 kHz I
CCR
0.4 1 mA
Power supply current, WRITE: SCL clock frequency = 100 kHz I
CCW
2 3 mA
Table 13: Serial Presence-Detect EEPROM AC Operating Conditions
Parameter/Condition Symbol Min Max Units Notes
SCL LOW to SDA data-out valid
t
AA 0.2 0.9 µs 1
Time the bus must be free before a new transition can start
t
BUF 1.3
µs
Data-out hold time
t
DH 200
ns
SDA and SCL fall time
t
F
300 ns 2
Data-in hold time
t
HD:DAT 0
µs
Start condition hold time
t
HD:STA 0.6
µs
Clock HIGH period
t
HIGH 0.6
µs
Noise suppression time constant at SCL, SDA inputs
t
I
50 ns
Clock LOW period
t
LOW 1.3
µs
SDA and SCL rise time
t
R
0.3 µs 2
SCL clock frequency
f
SCL
400 kHz
Data-in setup time
t
SU:DAT 100
ns
Start condition setup time
t
SU:STA 0.6
µs 3
Stop condition setup time
t
SU:STO 0.6
µs
WRITE cycle time
t
WRC
10 ms 4
Notes:
1. To avoid spurious start and stop conditions, a minimum delay is placed between SCL = 1
and the falling or rising edge of SDA.
2. This parameter is sampled.
3. For a restart condition, or following a WRITE cycle.
4. The SPD EEPROM WRITE cycle time (
t
WRC) is the time from a valid stop condition of a
write sequence to the end of the EEPROM internal ERASE/PROGRAM cycle. During the
WRITE cycle, the EEPROM bus interface circuit is disabled, SDA remains HIGH due to pull-
up resistance, and the EEPROM does not respond to its slave address.
Serial Presence-Detect Data
For the latest serial presence-detect data, refer to Micron's SPD page: www.micron.com/
SPD.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Serial Presence-Detect EEPROM
PDF: 09005aef83d4d75e
htf18c128_256x72fdz.pdf - Rev. B 07/10 EN
11
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.
Module Dimensions
Figure 4: 240-Pin DDR2 FBDIMM
30.5 (1.201)
30.2 (1.189)
Pin 1
17.3 (0.681)
TYP
2.60 (0.102) D
(2X)
5.2 (0.205)
TYP
5.0 (0.197) TYP
123.0 (4.843)
TYP
1.0 (0.039)
TYP
0.80 (0.031)
TYP
1.5 (0.059) R
(4X)
0.75 (0.03) R
Pin 120
Front view
133.50 (5.256)
133.20 (5.244)
67.0 (2.638)
TYP
51.0 (2.01)
TYP
9.5 (0.374)
TYP
Back view
Pin 240
Pin 121
1.25 (0.0492)
TYP
66.68 (2.63) TYP
0.595 (0.0234) R
2.0 (0.079)
TYP
3.9 (0.153)
TYP
(x2)
120° (2X)
2.18 (0.086) TYP
74.68 (2.94)
TYP
3.05 (0.120) TYP
66.68 (2.63)
TYP
24.95 (0.982)
TYP
Detail A
Detail A
1.19 (0.047)
1.06 (0.042)
1.06 (0.042)
45° x 0.18 (0.0071)
0.5 (0.02) R
(4X)
0.75 (0.030) R 8X
9.9 (0.39)
TYP
(X4)
Front view with heat spreader
Back view with heat spreader
3.1 (0.122) TYP
5.48 (0.216)
TYP
U1
U20
U2 U3 U4
U5
U6 U7
U8
U9
U10 U11
U12
U13
U14
U15
U16
U17 U18 U19
U20
U1 U2 U3 U4
U5
U6 U7
U8
U9
U10 U11
U12
U13
U14
U15
U16
U17 U18 U19
1.37 (0.054)
1.17 (0.046)
5.1 (0.201)
MAX
7.68 (0.302)
MAX*
1.37 (0.054)
1.17 (0.046)
*Including clip radius
7.92 (0.312) MAX
Notes:
1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted.
2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for
additional design dimensions.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
www.micron.com/productsupport Customer Comment Line: 800-932-4992
Micron and the Micron logo are trademarks of Micron Technology, Inc.
All other trademarks are the property of their respective owners.
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
1GB, 2GB (x72, DR) 240-Pin DDR2 SDRAM FBDIMM
Module Dimensions
PDF: 09005aef83d4d75e
htf18c128_256x72fdz.pdf - Rev. B 07/10 EN
12
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2009 Micron Technology, Inc. All rights reserved.

MT18HTF12872FDZ-667G1N8

Mfr. #:
Manufacturer:
Micron
Description:
MODULE DDR2 SDRAM 1GB 240FBDIMM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union