MWI300-17E9

© 2007 IXYS All rights reserved
1 - 3
20070912a
Advanced Technical Information
MWI 300-17 E9
IXYS reserves the right to change limits, test conditions and dimensions.IXYS reserves the right to change limits, test conditions and dimensions.
I
C80
= 350 A
V
CES
= 1700 V
V
CE(sat) typ.
= 2.3 V
IGBT Modules
Sixpack
NPT
3
IGBT
Features
NPT
3
IGBT technology
low saturation voltage
low switching losses
square RBSOA, no latch up
high short circuit capability
positive temperature coefficient for
easy parallelling
MOS input, voltage controlled
ultra fast free wheeling diodes
solderable pins for PCB mounting
package with copper base plate
Advantages
space savings
reduced protection circuits
package designed for wave soldering
Typical Applications
AC motor control
AC servo and robot drives
power supplies
IGBTs
Symbol Conditions Maximum Ratings
V
CES
T
VJ
= 25°C to 125°C 1700 V
V
GES
±
20 V
I
C25
T
C
= 25°C 500 A
I
C80
T
C
= 80°C 350 A
RBSOA R
G
= 3.3 Ω; T
VJ
= 125°C I
CM
= 700 A
Clamped inductive load; L = 100 µH V
CEK
V
CES
t
SC
V
CE
= 1200 V; V
GE
=
±
15 V; R
G
= 3.3 Ω;10µs
(SCSOA) T
VJ
= 125°C; non-repetitive; V
CEmax
< V
CES
P
tot
T
C
= 25°C 2.2 kW
Symbol Conditions Characteristic Values
(T
VJ
= 25°C, unless otherwise specified)
min. typ. max.
V
CE(sat)
I
C
= 300 A; V
GE
= 15 V; T
VJ
= 25°C 2.3 2.7 V
T
VJ
= 125°C 2.7 3.2 V
V
GE(th)
I
C
= 30 mA; V
GE
= V
CE
4.5 6.5 V
I
CES
V
CE
= V
CES
;
V
GE
= 0 V; T
VJ
= 25°C 0.5 1 mA
T
VJ
= 125°C 7 22 mA
I
GES
V
CE
= 0 V; V
GE
=
±
20 V 1.5 µA
t
d(on)
180 ns
t
r
110 ns
t
d(off)
500 ns
t
f
110 ns
E
on
100 mJ
E
off
80 mJ
C
ies
V
CE
= 25 V; V
GE
= 0 V; f = 1 MHz 33 nF
Q
Gon
V
CE
= 900 V; V
GE
= 15 V; I
C
= 300 A 2.6 µC
R
thJC
0.057 K/W
Inductive load, T
VJ
= 125°C
V
CE
= 900 V; I
C
= 300 A
V
GE
=
±
15 V; R
G
= 3.3 Ω
642
531
272217
252015
231813
241914
7/8
9/10
11/12
262116
28
29
See outline drawing for pin arrangement
E72873
© 2007 IXYS All rights reserved
2 - 3
20070912a
Advanced Technical Information
MWI 300-17 E9
Module
Symbol Conditions Maximum Ratings
T
VJ
operating -40...+125 °C
T
JM
+150 °C
T
stg
-40...+125 °C
V
ISOL
I
ISOL
1 mA; 50/60 Hz 3400 V~
M
d
Mounting torque (M5) 3 - 6 Nm
Terminal connection torque (M6) 3 - 6 Nm
Symbol Conditions Characteristic Values
min. typ. max.
R
term-chip
*
)
Resistance terminal to chip 0.55 mΩ
d
S
Creepage distance on surface 12.7 mm
d
A
Strike distance in air 10 mm
R
thCH
with heatsink compound 0.01 K/W
Weight 900 g
*
)
V = V
CE(sat)
+ 2x R
term-chip
· I
C
resp. V = V
F
+ 2x R
term-chip
· I
F
Temperature Sensor NTC
Symbol Conditions Characteristic Values
min. typ. max.
R
25
T = 25°C 4.75 5.0 5.25 kΩ
B
25/50
3375 K
Diodes
Symbol Conditions Maximum Ratings
I
F80
T
C
= 80°C 290 A
I
FRM
t
p
= 1 ms 570 A
I
2
t T
VJ
= 125°C; t = 10 ms; V
R
= 0 V 13000 A
2
s
Symbol Conditions Characteristic Values
min. typ. max.
V
F
I
F
= 300 A; V
GE
= 0 V; T
VJ
= 25°C 2.3 V
I
RM
I
F
= 300 A; di
F
/dt = 2400 A/µs; 240 A
T
VJ
= 125°C; V
R
= 1200 V
R
thJC
0.11 K/W
© 2007 IXYS All rights reserved
3 - 3
20070912a
Advanced Technical Information
MWI 300-17 E9
Dimensions in mm (1 mm = 0.0394")
=
tolerance for all dimensions:

MWI300-17E9

Mfr. #:
Manufacturer:
Description:
MOD IGBT SIXPACK E+
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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