1999 Nov 16 2
Philips Semiconductors Product specification
Fast soft-recovery
controlled avalanche rectifiers
BYD37 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Low leakage current
• Excellent stability
• Guaranteed avalanche energy
absorption capability
• Smallest surface mount rectifier
outline
• Shipped in 8 mm embossed tape.
DESCRIPTION
Cavity free cylindrical glass package
through Implotec
(1)
technology.
This package is hermetically sealed
and fatigue free as coefficients of
expansion of all used parts are
matched.
(1) Implotec is a trademark of Philips.
handbook, 4 columns
MAM061
ka
Fig.1 Simplified outline (SOD87) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
RRM
repetitive peak reverse voltage
BYD37D − 200 V
BYD37G − 400 V
BYD37J − 600 V
BYD37K − 800 V
BYD37M − 1000 V
V
R
continuous reverse voltage
BYD37D − 200 V
BYD37G − 400 V
BYD37J − 600 V
BYD37K − 800 V
BYD37M − 1000 V
I
F(AV)
average forward current T
tp
= 105 °C; see Fig.2;
averaged over any 20 ms period;
see also Fig.6
− 1.5 A
I
F(AV)
average forward current T
amb
=60°C; PCB mounting (see
Fig.11); see Fig.3;
averaged over any 20 ms period;
see also Fig.6
− 0.6 A
I
FRM
repetitive peak forward current T
tp
= 105 °C; see Fig.4 − 13 A
T
amb
=60°C; see Fig.5 − 5.5 A
I
FSM
non-repetitive peak forward current t = 10 ms half sine wave; T
j
=T
j max
prior to surge; V
R
=V
RRMmax
− 20 A
