TLP3823,TLP3823F
7
15.
15.
15.
15. Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
Land Pattern Dimensions (for reference only)
(Unit: mm)
TLP3823
Fig.
Fig.
Fig.
Fig. 15.1
15.1
15.1
15.1 Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
(LF1), (TP1), (LF5), (TP5)
TLP3823F
Fig.
Fig.
Fig.
Fig. 15.2
15.2
15.2
15.2 Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
Lead forming and taping option
(LF4), (TP4)
16.
16.
16.
16. Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Ordering Information (Example of Item Name)
Item Name
TLP3823(F(O
TLP3823(LF1,F(O
TLP3823(LF5,F(O
TLP3823(TP1,F(O
TLP3823(TP5,F(O
TLP3823F(F(O
TLP3823F(LF4,F(O
TLP3823F(TP4,F(O
Packaging (Note 1)
TH
LF1
LF5
TP1
TP5
TH, Wide forming
LF4, Wide forming
TP4, Wide forming
Packing (MOQ)
Magazine (50 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1500 pcs)
Tape and reel (1500 pcs)
Magazine (50 pcs)
Magazine (50 pcs)
Tape and reel (1000 pcs)
Note 1: TH: Through-hole, LF/TP: Lead forming for surface mount
2017-09-26
Rev.2.0
©2016-2017
Toshiba Electronic Devices & Storage Corporation
