ADG601BRTZ-REEL7 Datasheet ADG601BRTZ-REEL7, ADG602BRTZ-REEL7, ADG601BRMZ | P4-P6

ADG601/ADG602 Data Sheet

Rev. D | Page 4 of 12

SINGLE SUPPLY

V

DD

= 5 V ± 10%, V

SS

= 0 V, GND = 0 V, unless otherwise noted.

Table 3.

B Version

1

Parameter +25°C −40°C to +85°C Unit Test Conditions/Comments

ANALOG SWITCH

Analog Signal Range 0 V to V

DD

V V

DD

= 4.5 V

On Resistance (R

ON

) 3.5 Ω typ V

S

= 0 V to 4.5 V, I

DS

= −10 mA; see Figure 15

5 8 Ω max

On-Resistance Flatness (R

FLAT (ON)

) 0.2 0.2 Ω typ V

S

= 1.5 V to 3.3 V, I

DS

= –10 mA

0.6 Ω max

LEAKAGE CURRENTS V

DD

= 5.5 V

Source Off Leakage, I

S

(Off) ±0.01 nA typ V

S

= 4.5 V/1 V, V

D

= 1 V/4.5 V; see Figure 16

±0.25 ±1 nA max

Drain Off Leakage, I

D

(Off) ±0.01 nA typ V

S

= 4.5 V/1 V, V

D

= 1 V/4.5 V; see Figure 16

±0.25 ±1 nA max

Channel On Leakage, I

D

, I

S

(On) ±0.01 nA typ V

S

= V

D

= 4.5 V or 1 V; see Figure 17

±0.25 ±1 nA max

DIGITAL INPUTS

Input High Voltage, V

INH

2.4 V min

Input Low Voltage, V

INL

0.8 V max

Input Current, I

INL

or I

INH

0.005 μA typ V

IN

= V

INL

or V

INH

±0.1 μA max

Digital Input Capacitance, C

IN

2 pF typ

DYNAMIC CHARACTERISTICS

2

t

ON

110 ns typ R

L

= 300 Ω, C

L

= 35 pF

220 280 ns max V

S

= 3.3 V; see Figure 18

t

OFF

50 ns typ R

L

= 300 Ω, C

L

= 35 pF

80 110 ns max V

S

= 3.3 V; see Figure 18

Charge Injection 20 pC typ V

S

= 0 V, R

S

= 0 Ω, C

L

= 1 nF; see Figure 19

Off Isolation −60 dB typ R

L

= 50 Ω, C

L

= 5 pF, f = 1 MHz; see Figure 20

Bandwidth –3 dB 180 MHz typ R

L

= 50 Ω, C

L

= 5 pF; see Figure 21

C

S

(Off) 50 pF typ f = 1 MHz

C

D

(Off) 50 pF typ f = 1 MHz

C

D

, C

S

(On) 145 pF typ f = 1 MHz

POWER REQUIREMENTS V

DD

= 5.5 V

I

DD

0.001 μA typ Digital inputs = 0 V or 5.5 V

1.0 μA max

1

Temperature range for B version is −40°C to +85°C.

2

Guaranteed by design, not subject to production test.

Data Sheet ADG601/ADG602

Rev. D | Page 5 of 12

ABSOLUTE MAXIMUM RATINGS

T

A

= 25°C, unless otherwise noted.

Table 4.

Parameter Rating

V

DD

to V

SS

13 V

V

DD

to GND −0.3 V to +6.5 V

V

SS

to GND +0.3 V to –6.5 V

Analog Inputs

1

V

SS

− 0.3 V to V

DD

+ 0.3 V

Digital Inputs

1

−0.3 V to V

DD

+ 0.3 V or

30 mA (whichever

occurs first)

Continuous Current, S or D 100 mA

Peak Current, S or D

(Pulsed at 1 ms, 10% Duty Cycle Max) 200 mA

Operating Temperature Range

Industrial (B Version) −40°C to +85°C

Storage Temperature Range −65°C to +150°C

Junction Temperature 150°C

Thermal Resistance

MSOP

θ

JA

206°C/W

θ

JC

44°C/W

SOT-23

θ

JA

229.6°C/W

θ

JC

91.99°C/W

Lead Temperature, Soldering (10 sec) 300°C

IR Reflow, Peak Temperature 260°C

1

Overvoltages at IN, S, or D are clamped by internal diodes. Current should be

limited to the maximum ratings given.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Only one absolute maximum rating may be applied at a time.

ESD CAUTION

ADG601/ADG602 Data Sheet

Rev. D | Page 6 of 12

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

V

DD

1

S

2

V

SS

3

IN

6

D

5

GND

4

ADG601/

ADG602

TOP VIEW

(Not to Scale)

0

2619-002

PIN 1

INDICATOR

Figure 2. 6-Lead SOT-23 (RJ-6)

D

1

NC

2

NC

3

V

DD

4

S

8

GND

7

IN

6

V

SS

5

NC = NO CONNECT

ADG601/

ADG602

TOP VIEW

(Not to Scale)

0

2619-003

PIN 1

INDICATOR

Figure 3. 8-Lead MSOP (RM-8)

Table 5. Pin Function Descriptions

Pin No.

Mnemonic Description

6-Lead SOT-23 8-Lead MSOP

1 4 V

DD

Most Positive Power Supply Potential.

2 8 S Source Terminal. Can be an input or output.

3 5 V

SS

Most Negative Power Supply Potential.

4 7 GND Ground (0 V) Reference.

5 1 D Drain Terminal. Can be an input or output.

6 6 IN Logic Control Input.

N/A

1

2, 3 NC No Connect.

1

N/A is not applicable.

02619-021

1

2

3

4

5

6

7

14

TOP VIEW

(Not to Scale)

13

12

11

10

9

8

Figure 4. Die (820 μm × 2255 μm)

Table 6. Die Pad Coordinates

1

Die Pad No.

Die Pad

Coordinates

Mnemonic Description

X (μm) Y (μm)

1 −265 +754 NC No Connect.

2 −265 +525 D Drain Terminal. Can be an input or output.

2

3 −265 +241 D Drain Terminal. Can be an input or output.

2

4 −265 +141 D Drain Terminal. Can be an input or output.

2

5 −265 −191 NC No Connect.

6 −265 −409 NC No Connect.

7 −265 −549 NC No Connect.

8 −265 −787 V

DD

Most Positive Power Supply Potential.

9 +265 −767 V

SS

Most Negative Power Supply Potential.

10 +265 −429 IN Logic Control Input.

11 +265 −289 GND Ground (0 V) Reference.

12 +265 +189 S Source Terminal. Can be an input or output.

3

13 +265 +521 S Source Terminal. Can be an input or output.

3

14 +265 +661 NC Source Terminal. Can be an input or output.

1

Measured from the center of the die.

2

Bond the D pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the drain pin of the switch.

3

Bond the S pads together to a single point to preserve the on resistance and current handling capability. The common point acts as the source pin of the switch.

ADG601BRTZ-REEL7

ADG601BRTZ-REEL7

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