MP2489 – STEP DOWN WLED DRIVER WITH WIDE 6V–60V INPUT VOLTAGE
MP2489 Rev. 1.23 www.MonolithicPower.com 2
10/11/2012 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2012 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number Package Top Marking
MP2489DJ*
TSOT23-5
AAD
MP2489DQ
QFN6 (3x 3mm)
9Y
MP2489DN
SOIC8E
MP2489
* For Tape & Reel, add suffix –Z (e.g. MP2489DJ–Z);
For RoHS Compliant Packaging, add suffix –LF (e.g. MP2489DJ–LF–Z)
PACKAGE REFERENCE
SW
GND
GND
EN/DIM
IN
GND
GND
RS
1
2
3
4
8
7
6
5
TOP VIEW
EXPOSED PAD
ON BACKSIDE
CONNECT TO GND
TSOT23-5 QFN6 (3x 3mm) SOIC8E
ABSOLUTE MAXIMUM RATINGS
(1)
V
IN
, V
SW
.........................................-0.3V to +65V
V
RS
..................................................V
IN
-5V to V
IN
All Other Pins...............................-0.3V to +6.3V
Continuous Power Dissipation (T
A
= +25°C)
(2)
TSOT23-5 .................................................. 1.3W
QFN6 ......................................................... 2.5W
SOIC8E...................................................... 2.6W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature............... -65°C to +150°C
Recommended Operating Conditions
(3)
Supply Voltage V
IN
..............................6V to 60V
Operating Junction Temp. (T
J
). -40°C to +125°C
Thermal Resistance
(4)
θ
JA
θ
JC
TSOT23-5 .............................100 ..... 55... °C/W
QFN6 (3mm x 3mm) ..............50 ...... 14... °C/W
SOIC8E ..................................48 ...... 10... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance θ
JA
, and the ambient temperature
T
A
. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by P
D
(MAX)=(T
J
(MAX)-
T
A
)/ θ
JA
. Exceeding the maximum allowable power dissipation
will cause excessive die temperature, and the regulator will go
into thermal shutdown. Internal thermal shutdown circuitry
protects the device from permanent damage.
3) The device is not guaranteed to function outside of its
operation conditions.
4) Measured on JESD51-7, 4-layer PCB.
