2
Absolute Maximum Ratings [1]
Parameter Symbol Units Absolute Maximum
Drain – Source Voltage
[2]
V
DS
V 3.6
2G Drain Current
[2]
I
DS_2G
mA 30
5G Drain Current
[2]
I
DS_5G
mA 45
Total Power Dissipation
[3]
Pdiss W 0.2
RF Input Power Pin max. dBm 5
Channel Temperature T
CH
*C 150
Storage Temperature T
STG
*C -65 to 150
Thermal Resistance
[4]
Tch_b
*C/W 29.9
Note:
5. Distribution data sample size is 18K samples taken from 3 dierent wafers and 3 dierent lots. Future wafers allocated to this product may have
nominal values anywhere between the upper and lower limits.
6. Measurements are made on production test board, which represents a trade-o between optimal Gain, NF, IIP3, IP1dB and VSWR. Circuit losses
have been de-embedded from actual measurements.
Product Consistency Distribution Charts
[5,6]
Notes:
1. Operation of this device above any one of these
parameters may cause permanent damage.
2. Assuming DC quiescent conditions.
3. Board (package belly) temperature TB is 25*C.
Derate 33.4mW/*C for TB > 144 *C.
4. Channel-to-board thermal resistance measured
using 150*C Liquid Crystal Measurement
method.
Stdev = 0.9
+3 Std
0 0.30.60.91.21.5
0
2000
4000
6000
8000
Stdev = 0.3
- 3 Std
+3 Std
15 16 17 18 19
0
2000
4000
6000
8000
10000
Stdev = 0.9
-3 Std
+3 Std
10 12 14 16 18 20 22
0
1000
2000
3000
4000
5000
6000
Stdev = 0.1
+3 Std
0.8 1.1 1.4 1.7 2 2.3
0
2000
4000
6000
8000
Stdev = 0.5
-3 Std
+3 Std
20 21 22 23 24 25 26
0
2000
4000
6000
8000
Stdev = 1.5
-3 Std
-3 Std
16 20 24 28 32
0
2000
4000
6000
8000
Figure 1. Gain @ 2.45GHz; LSL = 15dB, Nominal = 16.7dB, USL = 18.5dB
Figure 2. NF @ 2.45GHz; Nominal = 0.8dB, USL = 1.5dB
Figure 3. Ids @ 2.45GHz; LSL = 11mA, Nominal = 15mA, USL = 21mA
Figure 4. Gain @ 5.5GHz; LSL = 21dB, Nominal = 23.2dB, USL = 25dB
Figure 5. NF @ 5.5GHz; Nominal = 1.4dB, USL = 1.9dB
Figure 6. Ids @ 5.5GHz; LSL = 19mA, Nominal = 23.4mA, USL = 31mA