Package information STTH3010
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In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. DOP3I dimensions
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 4.40 4.60 0.173 0.181
b 1.20 1.40 0.047 0.055
c 1.45 1.55 0.057 0.061
c1 0.50 0.70 0.020 0.028
D 12.15 13.10 0.474 0.516
E 15.10 15.50 0.594 0.610
E1 7.55 7.75 0.297 0.305
e 10.80 11.30 0.425 0.445
G 20.4 21.10 0.815 0.831
L 14.35 15.60 0.565 0.614
P 4.08 4.17 0.161 0.164
Q 2.70 2.90 0.106 0.114
R 4.60 typ. 0.181 typ.
Y 15.80 16.50 0.622 0.650
R
E
E1
G
Y
D
Q
c1
c
A
L
e
b
ØP
