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LT5579IUH#TRPBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
LT5579
7
5579fa
Conversion Gain and OIP3
vs RF Output Frequency
SSB Noise Figure
vs RF Output Frequency
LO-RF Leakage
vs RF Output Frequency
Conversion Gain and OIP3
vs LO Input Power
SSB Noise Figure
vs LO Input Power
Conversion Gain and OIP3
vs Supply Voltage
IM3 Level
vs RF Output Power (2-Tone)
IM2 Level
vs RF Output Power (2-Tone)
SSB Noise Figure
vs Supply Voltage
Typical perForMance characTerisTics
V
CC
= 3.3V, T
A
= 25°C, f
IF
= 240MHz, P
IF
= –5dBm (–5dBm/tone for 2-tone tests, ∆f = 1MHz), high side LO, P
LO
= –1dBm,
output measured at 2140MHz, unless otherwise noted. (Test circuit shown in Figure 1)
2140MHz Application:
RF FREQUENCY (MHz)
1950
GAIN (dB)
OIP3 (dBm)
4
8
2350
5579 G23
0
–4
2050
2150
GAIN
OIP3
2250
16
12
18
22
14
10
30
26
85°C
25°C
–40°C
RF FREQUENCY (MHz)
1950
NOISE FIGURE (dB)
10
12
14
2350
5579 G24
8
6
2
2050
2150
2250
4
18
16
85°C
25°C
–40°C
RF FREQUENCY (MHz)
1950
LO LEAKAGE (dBm)
–30
–20
2350
5579 G25
–40
–50
2050
2150
2250
0
–10
85°C
25°C
–40°C
LO INPUT POWER (dBm)
–17
GAIN (dB)
OIP3 (dBm)
8
12
16
–1
5579 G26
4
OIP3
0
–4
22
26
30
18
14
10
–13
–9
–5
3
85°C
25°C
–40°C
GAIN
LO INPUT POWER (dBm)
–14
NOISE FIGURE (dB)
10
12
14
2
5579 G27
8
6
2
–10
–6
–2
4
18
16
85°C
25°C
–40°C
SUPPLY VOLTAGE (V)
3.0
–4
GAIN (dB)
OIP3 (dBm)
0
4
8
16
12
10
14
18
22
30
26
3.1
3.2 3.3 3.4
GAIN
OIP3
5579 G19
3.5 3.6
85°C
25°C
–40°C
RF OUTPUT POWER (dBm/TONE)
–10
IM3 LEVEL (dBc)
–40
–20
0
–4 0 6
5579 G29
–60
–80
–100
–8 –6
–2
2 4
85°C
25°C
–40°C
RF OUTPUT POWER (dBm/TONE)
–10
IM2 LEVEL (dBc)
–40
–20
0
–4 0 6
5579 G30
–60
–80
–100
–8 –6
–2
2 4
85°C
25°C
–40°C
SUPPLY VOLTAGE (V)
3.0
NOISE FIGURE (dB)
10
12
14
3.3
3.5
5579 G31
8
6
4
2
3.1 3.2 3.4
16
18
3.6
85°C
25°C
–40°C
LT5579
8
5579fa
Conversion Gain and OIP3
vs RF Output Frequency
SSB Noise Figure
vs RF Output Frequency
LO-RF Leakage
vs RF Output Frequency
Conversion Gain and OIP3
vs LO Input Power
SSB Noise Figure
vs LO Input Power
Conversion Gain and OIP3
vs Supply Voltage
IM3 Level
vs RF Output Power (2-Tone)
IM2 Level
vs RF Output Power (2-Tone)
SSB Noise Figure
vs Supply Voltage
Typical perForMance characTerisTics
V
CC
= 3.3V, T
A
= 25°C, f
IF
= 240MHz, P
IF
= –5dBm (–5dBm/tone for 2-tone tests, ∆f = 1MHz), low side LO, P
LO
= –1dBm,
output measured at 1750MHz, unless otherwise noted. (Test circuit shown in Figure 1)
1750MHz Application:
RF FREQUENCY (MHz)
1650
GAIN (dB)
OIP3 (dBm)
8
12
16
1850
5579 G32
4
OIP3
0
–4
22
26
30
18
14
10
1700
1750
1800
1900
85°C
25°C
–40°C
GAIN
RF FREQUENCY (MHz)
1650
NOISE FIGURE (dB)
8
10
12
1800
1900
5579 G33
6
4
2
1700 1750 1850
14
16
18
85°C
25°C
–40°C
RF FREQUENCY (MHz)
1650
LO LEAKAGE (dBm)
–20
–10
0
1850
5579 G34
–30
–40
–50
1700
1750
1800
1900
85°C
25°C
–40°C
LO INPUT POWER (dBm)
–17
GAIN (dB)
OIP3 (dBm)
8
12
16
–1
5579 G35
4
OIP3
0
–4
22
26
30
18
14
10
–13
–9
–5
3
85°C
25°C
–40°C
GAIN
LO INPUT POWER (dBm)
–17
NOISE FIGURE (dB)
8
10
12
–5
3
5579 G36
6
4
2
–13 –9 –1
14
16
18
85°C
25°C
–40°C
SUPPLY VOLTAGE (V)
3.0
–4
GAIN (dB)
OIP3 (dBm)
0
4
8
12
16
OIP3
GAIN
12
16
20
24
28
32
3.1
3.2 3.3 3.4
5579 G37
3.5 3.6
85°C
25°C
–40°C
RF OUTPUT POWER (dBm/TONE)
–10
IM3 LEVEL (dBc)
–40
–20
0
–4 0 6
5579 G38
–60
–80
–100
–8 –6
–2
2 4
85°C
25°C
–40°C
RF OUTPUT POWER (dBm/TONE)
–10
IM2 LEVEL (dBc)
–40
–20
0
–4 0 6
5579 G39
–60
–80
–100
–8 –6
–2
2 4
85°C
25°C
–40°C
SUPPLY VOLTAGE (V)
3.0
NOISE FIGURE (dB)
8
10
12
3.3
3.5
5579 G40
6
4
2
3.1 3.2 3.4
14
16
18
3.6
85°C
25°C
–40°C
LT5579
9
5579fa
pin FuncTions
GND (Pins 1, 2, 5-7, 12-14, 16-18, 19-21, 23, 24): Ground
Connections. These pins are internally connected to the
exposed pad and should be soldered to a low impedance
RF ground on the printed circuit board.
IF
+
, IF
–
(Pins 3, 4): Differential IF Input. The common
mode voltage on these pins is set internally to 570mV. The
DC current from each pin is determined by the value of
an external resistor to ground. The maximum DC current
through each pin is 60mA.
V
CC
(Pins 8-11): Power Supply Pins for the IC. These
pins are connected together internally. Typical current
consumption is 226mA. These pins should be connected
together on the circuit board with external bypass capaci
-
tors of 1000pF, 100pF and 10pF located as close to the
pins as possible.
RF (Pin 15): Single-Ended RF
Output. This pin is con-
nected to an internal transformer winding. The opposite
end of the winding is grounded internally. An impedance
transformation may be required to match the output and a
DC decoupling capacitor is required if the following stage
has a DC bias voltage present.
LO (Pin 22): Single-Ended Local Oscillator Input. An internal
series capacitor acts as a DC block to this pin.
Exposed Pad (Pin 25): PGND. Electrical
and thermal
ground connection for the entire IC. This pad must be
soldered to a low impedance RF ground on the printed
circuit board. This ground must also provide a path for
thermal dissipation.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

LT5579IUH#TRPBF

Mfr. #:
Buy LT5579IUH#TRPBF
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer 1.5 GHz to 3.8GHz High Linearity Upconverting Mixer
Lifecycle:
New from this manufacturer.
Delivery:
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