2001 Dec 11 3
Philips Semiconductors Product specification
N-channel enhancement mode
vertical D-MOS transistor
BSP130
THERMAL CHARACTERISTICS
Note
1. Device mounted on an epoxy printed-circuit board, 40 x 40 x 1.5 mm, mounting pad for the drain tab minimum 6 cm
2
.
STATIC CHARACTERISTICS
T
j
= 25 °C unless otherwise specified.
SYMBOL PARAMETER VALUE UNIT
R
th j-a
thermal resistance from junction to ambient; note 1 83.3 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
(BR)DSS
drain-source breakdown voltage I
D
=10µA; V
GS
= 0 300 −−V
I
GSS
gate-source leakage current V
GS
= ±20 V; V
DS
=0 −−±100 nA
V
GSth
gate-source threshold voltage I
D
= 1 mA; V
DS
=V
GS
0.8 − 2V
R
DSon
drain-source on-state resistance I
D
= 20 mA; V
GS
= 2.4 V − 4.8 10 Ω
I
D
= 250 mA; V
GS
=10V − 3.7 6 Ω
I
DSS
drain-source leakage current V
DS
= 240 V; V
GS
=0 −−100 nA
Y
fs
transfer admittance I
D
= 250 mA; V
DS
= 25 V 200 690 − mS
C
iss
input capacitance V
DS
= 25 V; V
GS
= 0; f = 1 MHz − 100 120 pF
C
oss
output capacitance V
DS
= 25 V; V
GS
= 0; f = 1 MHz − 21 30 pF
C
rss
feedback capacitance V
DS
= 25 V; V
GS
= 0; f = 1 MHz − 10 15 pF
Switching times (see Figs 2 and 3)
t
on
turn-on time I
D
= 250 mA; V
DD
=50V;
V
GS
=0to10V
− 610ns
t
off
turn-off time I
D
= 250 mA; V
DD
= 50 V;
V
GS
= 10 to 0 V
− 46 60 ns