SMD Transient Voltage Suppressor
TVP06B6V8-G Thru. TVP06B601-G
Breakdown Voltage: 6.8 to 600 Volts
Power Dissipation: 600 Watts
RoHS Device
Mechanical Data
-Case: Molded plastic, JEDEC SMB/DO-214AA
0.087(2.20)
0.077(1.96)
0.155(3.94)
0.130(3.30)
0.191(4.85)
0.171(4.35)
0.012(0.30)
0.006(0.15)
0.096(2.44)
0.084(2.13)
0.060(1.52)
0.030(0.75)
0.008(0.20)
0.001(0.02)
0.216(5.50)
0.201(5.10)
Dimensions in inches and (millimeter)
SMB/DO-214AA
Maximum Ratings and Electrical Characteristics
Rating at 25°C ambient temperature unless otherwise specified.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Symbol
Value
Units
Peak power dissipation with a 10/1000μs
waveform (Note 1 )
Peak pulse current 10/1000 with a μs
waveform (Note 1)
Peak forward surge current, 8.3ms single half
sine-wave uni-directional only (Note 2)
Maximum instantaneous forward voltage at
25.0A for uni-directional only (Note 3)
Operation junction temperature
Storage temperature range
PPP
IPP
PD
IFSM
VF
TJ
TSTG
600
See Next Table
5.0
100
3.5/5.0
-55 to +150
W
A
W
A
V
°C
QW-BTV18
Note:
1. Non-repetitive current pulse, per Fig.5 and derated above TA=25°C per Fig.1
2. Measured on 8.3 ms single half sine-wave or equivalent square wave, duty cycle = 4 pulse per minute maximum.
3. VF<3.5V for devices of VBR <200V and VF <5.0V for devices of VBR >201V.
Page 1
REV:C
-Epoxy: UL 94V-0 rate flame retardant.
-55 to +150
-Weight: 0.108 gram (a )pprox.
-Polarity: Color cathode end band denotes
except Bipolar.
Company reserves the right to improve product design , functions and reliability without notice.
Power dissipation on infinite heatsink
at TL=75°C
°C
Features
- Glass passivated chip.
- 600W peak pulse power capability with a 10/1000µs
waveform, repetitive rate (duty cycle):0.01%
- Low leakage.
- Uni and Bidirectional unit.
- Excellent clamping capability.
- Very fast response time.
R
- UL recognized file # E349157
- Range: TVP06B6V8 thru. TVP06B510(C)A (C)A
Comchip Technology CO., LTD.
-Lead: solderable per MIL-STD-750,
method 2026
